Polytec TC 351
- Chemical Family
- Epoxy & Epoxy Derivatives
Polytec TC 351 is a single component, thermally conductive epoxy with good thermal conductivity and excellent resistance towards moisture and chemicals. It was designed for all applications where electrically insulating and thermally conductive bonds are desirable. Polytec TC 351 has a conveniently long pot and shelf life. Typical applications are bonding of sensors in metal holders and fixation of single devices on PCBs. Due to the long pot and shelf life it is ideal for high volume dispensing techniques. The material can be applied by dispensing, screen or stencil printing.
Properties
- Physical Form
- Paste
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Adhesives & Sealants
- Printed Circuit Boards (PCBs)
Product Families
- Other Adhesives & Sealants
Other characteristics
- Brand
- Polytec TC
- Product Type
- 1K (1 component) Adhesive, Epoxy Adhesive
- 1K (1 component) Adhesive
- Epoxy Adhesive
- Application Area
- Printed Circuit Boards
- Note
*Curing temperatures refer to the temperature in the respective bond line. When choosing the respective curing conditions, the time needed to heat the substrate has to be considered. Depending on the type of heat source (convection oven, hot stamp, heating plate) the heat input may vary.
- Markets
- Consumer Goods
- Electrical & Electronics
- Processing
For two component products the components A and B should be mixed carefully within the specified mixing ratio; For filled products both components should be homogenized carefully prior mixing, in order to prevent a possible settling of the filler; Processing should be carried out rapidly after mixing the components as an indication the pot life can be used; Surfaces should be clean, thus free of dirt, grease, oil, dust or process chemicals; One component products can be applied directly and are not subject to a pot life (except pre mixed/frozen products); Please take notice of respective minimum curing temperature and time
- Technology
- Ready-to-Use Products
- Pot Life (23°C)
- 1 Months
- Standard Pack Sizes
- 30cc / 60 g
- 250 g, 500 g
- 1 kg, 25 kg
- Customized Packaging
- Storage Stability (6-8°C)
- 6 Months
- Ready to Use Product Features
- Chemical Resistant
- Electrically Insulating
- Good Moisture Resistance
- Long Potlife
- Long Shelf Life
- Thermally Conductive
- Thixotropic
Technical data
Table 1 of 3
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Curing Time (120°C) | 45.0 | Minutes |
| Curing Time (150°C) | 10.0 | Minutes |
| Curing Temperature | min. 120 | °C |
Table 2 of 3
12 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Degradation Temperature | 350.0 | °C | TM 302 |
| Dielectric Strength | min. 30 | kV/mm | — |
| Elongation at Break | 0.7 | % | TM 605 |
| Glass Transition Temperature (Tg) | 87.0 | °C | TM 501 |
| Hardness | 85.0 | Shore D | DIN EN ISO 868 |
| Lap Shear Strength (Al/Al) | 20.0 | N/mm² | TM 604 |
| Temperature Resistance Continuous | -55 to 200 | °C | TM 302 |
| Temperature Resistance Short Term | -55 to 300 | °C | TM 302 |
| Tensile Strength | 56.0 | N/mm² | TM 605 |
| Thermal Conductivity | 0.7 - 0.9 | W/m.K | TM 502 |
| Water Absorption (24h, 23°C) | 0.11 | % | TM 301 |
| Young Modulus | 11000.0 | N/mm² | TM 605 |
Table 3 of 3
7 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Chemical Basis | Epoxy | — | — |
| Consistency | Creamy Paste | — | TM 101 |
| Density (Mix) | 1.9 | g/cm³ | TM 201.2 |
| Particle Size | max. 45 | μm | — |
| Number of Components | 1.0 | — | — |
| Type of Filler | Aluminiumoxide | — | — |
| Viscosity Mix (84s⁻¹, 23°C) | 65000.0 | mPa.s | TM 202.1 |
