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Polytec TC 417-2

Polytec TC 417 2 is a two component, thermally conductive, electrically insulating epoxy It is used in various thermal management applications, especially for potting of large volumes. Polytec TC 417 2 has an excellent chemical and moisture resistance It has an excellent adhesion to glass, metal, ceramic, FR 4 and most plastics. The room temperature cure allows to bond temperature sensitive substrates very conveniently The material can be applied via dispensing or manual application.

Properties

Physical Form
Paste

Product families

Applications

Applications
  • Consumer Goods — Appliances & Electronics
Electrical & Electronics — Packaging & Assembly
  • Adhesives & Sealants

Product Families

Ready-to-Use Products — Adhesives & Sealants
  • Encapsulants

Other characteristics

Brand
Polytec TC
Cure Method
Air Dry
Product Type

2K (2 component) Adhesive, Epoxy Adhesive, Insulation Adhesive, Potting Compound, Solvent free (100% Solids) Adhesive; 2K (2 component) Adhesive; Epoxy Adhesive; Insulation Adhesive; Potting Compound; Solvent free (100% Solids) Adhesive

Compatible Substrates & Surfaces
Ceramic, Glass, Metal, Plastics
Note

*Curing temperatures refer to the temperature in the respective bond line. When choosing the respective curing conditions, the time needed to heat the substrate has to be considered. Depending on the type of heat source (convection oven, hot stamp, heating plate) the heat input may vary.

Markets
  • Consumer Goods
  • Electrical & Electronics
Processing

For two component products the components A and B should be mixed carefully within the specified mixing ratio; For filled products both components should be homogenized carefully prior mixing, in order to prevent a possible settling of the filler; Processing should be carried out rapidly after mixing the components as an indication the pot life can be used; Surfaces should be clean, thus free of dirt, grease, oil, dust or process chemicals; One component products can be applied directly and are not subject to a pot life (except pre mixed/frozen products); Please take notice of respective minimum curing temperature and time

Cure
Air Dry
Technology
Ready-to-Use Products
Standard Pack Sizes
  • 250 g, 500 g
  • 1 kg, 25 kg
  • Customized Packaging
  • Also available as pre-mixed frozen product
Storage Stability (23°C)
12 Months
Pot Life (15g Mixture, 23°C)
6 Hours
Ready to Use Product Features
  • Chemical Resistant
  • Electrically Insulating
  • Excellent Flowability
  • Good Moisture Resistance
  • High Flowability
  • Thermally Conductive
Compatible Substrates and Surfaces
  • Ceramic
  • Glass
  • Metal
  • Plastics

Technical data

Table 1 of 3

4 rows
CharacteristicValueUnit
Curing Time (100°C)30.0Minutes
Curing Time (23°C)24.0Hours
Curing Time (80°C)60.0Minutes
Curing Temperaturemin. 15°C

Table 2 of 3

16 rows
CharacteristicValueUnitMethod
Coefficient of Thermal Expansion (<Tg)38.0ppmISO 11359-2
Coefficient of Thermal Expansion (>Tg)145.0ppmISO 11359-2
Degradation Temperature300.0°CTM 302
Dielectric Strengthmin. 10kV/mmTM 402
Elongation at Break1.1%TM 605
Glass Transition Temperature (Tg)70 - 80°CTM 501
Hardness85.0Shore DDIN EN ISO 868
Lap Shear Strength (Al/Al)To Be DeterminedN/mm²TM 604
Loss Factor0.022—Ring Resonator
Permittivity3.68—Ring Resonator
Temperature Resistance Continuous-55 to 180°CTM 302
Temperature Resistance Short Term-55 to 250°CTM 302

Table 3 of 3

13 rows
CharacteristicValueUnitMethod
Chemical BasisEpoxy——
ConsistencyFlowable paste—TM 101
Density (A-Part)2.1g/cm³TM 201.2
Density (B-Part)0.95g/cm³TM 201.2
Density (Mix)1.8g/cm³TM 201.2
Particle Sizemax. 50μm—
Mixing Ratio (Volume)1900-01-03T04:27:00+00:00——
Mixing Ratio (Weight)1900-01-03T04:13:00+00:00——
Number of Components2.0——
Type of FillerAluminiumoxide——
Viscosity Mix (84s⁻¹, 23°C)4000.0mPa.sTM 202.1
Viscosity A-Part (84s⁻¹, 23°C)60000.0mPa.sTM 202.1

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