Polytec TC 432
- Chemical Family
- Epoxy & Epoxy Derivatives
Polytec TC 432 is a thixotropic, two component, highly thermally conductive, electrically insulating epoxy for thermal management in micro and power electronics, energy engineering etc. Polytec TC 432 has an excellent adhesion to ceramic, glass, semiconductor materials, ferrous and non ferrous metals and most plastics. The material can be applied via dispensing, screen printing, or manual application.
Properties
- Physical Form
- Paste
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Adhesives & Sealants
Product Families
- Other Adhesives & Sealants
Other characteristics
- Brand
- Polytec TC
- Product Type
- 2K (2 component) Adhesive, Epoxy Adhesive
- 2K (2 component) Adhesive
- Epoxy Adhesive
- Compatible Substrates & Surfaces
- Ceramic, Glass, Plastics
- Note
*Curing temperatures refer to the temperature in the respective bond line. When choosing the respective curing conditions, the time needed to heat the substrate has to be considered. Depending on the type of heat source (convection oven, hot stamp, heating plate) the heat input may vary.
- Markets
- Consumer Goods
- Electrical & Electronics
- Processing
For two component products the components A and B should be mixed carefully within the specified mixing ratio; For filled products both components should be homogenized carefully prior mixing, in order to prevent a possible settling of the filler; Processing should be carried out rapidly after mixing the components as an indication the pot life can be used; Surfaces should be clean, thus free of dirt, grease, oil, dust or process chemicals; One component products can be applied directly and are not subject to a pot life (except pre mixed/frozen products); Please take notice of respective minimum curing temperature and time
- Technology
- Ready-to-Use Products
- Pot Life (23°C)
- 15 Minutes
- Standard Pack Sizes
- 250 g, 500 g
- 1 kg
- Customized Packaging
- Storage Stability (23°C)
- 12 Months
- Ready to Use Product Features
- Electrically Insulating
- Good Thermal Stability
- High Glass Transition Temperature
- Non Abrasive
- Soft
- Thermally Conductive
- Thixotropic
- Compatible Substrates and Surfaces
- Ceramic
- Glass
- Plastics
Technical data
Table 1 of 3
2 rows| Characteristic | Value | Unit |
|---|---|---|
| Curing Time (23°C) | 24.0 | Hours |
| Curing Temperature | min. 15 | °C |
Table 2 of 3
9 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Degradation Temperature | 350.0 | °C | TM 302 |
| Elongation at Break | 0.4 | % | TM 605 |
| Hardness | min. 65 | Shore D | DIN EN ISO 868 |
| Lap Shear Strength (Al/Al) | 9.0 | N/mm² | TM 604 |
| Temperature Resistance Continuous | -55 to 180 | °C | TM 302 |
| Temperature Resistance Short Term | -55 to 230 | °C | TM 302 |
| Tensile Strength | 36.0 | N/mm² | TM 605 |
| Thermal Conductivity | 1.6 - 2 | W/m.K | TM 502 |
| Young Modulus | 10000.0 | N/mm² | TM 605 |
Table 3 of 3
10 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Chemical Basis | Epoxy | — | — |
| Consistency | Thixotropic paste | — | TM 101 |
| Density (A-Part) | 1.58 | g/cm³ | TM 201.2 |
| Density (B-Part) | 0.98 | g/cm³ | TM 201.2 |
| Density (Mix) | 1.5 | g/cm³ | TM 201.2 |
| Particle Size | max. 140 | μm | — |
| Mixing Ratio (Weight) | 1900-01-03T04:07:00+00:00 | — | — |
| Number of Components | 2.0 | — | — |
| Type of Filler | Boron nitride | — | — |
| Viscosity Mix (10s⁻¹, 23°C) | 65000.0 | mPa.s | TM 202.11 |
