Polytec PU 1000
- Chemical Family
- Polyurethanes (PU)
Polytec PU 1000 is a one-component, room- temperature curing, highly flexible with excellent polyurethane-adhesive electrical conductivity. Polytec PU 1000 has been specifically developed for contacting chip modules on dual interface smart cards. It is used in micro electronics, hybrid and electronic applications. Polytec PU 1000 cures at room temperature or accelerated with heat. Polytec PU 1000 stands out due to its high flexibility combined with mechanical strength. It is also suitable for electrical contacting of copper surfaces The material can be applied by dispensing, jet-dispensing or manually.
Properties
- Physical Form
- Paste
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Adhesives & Sealants
Product Families
- Conductive Adhesives
Other characteristics
- Brand
- Polytec PU
- Cure Method
- Air Dry
- Product Type
- 1K (1 component) Adhesive, Conductive Adhesive
- 1K (1 component) Adhesive
- Conductive Adhesive
- Application Area
- Chip Module, Credit Card
- Chip Module
- Credit Card
- Compatible Substrates & Surfaces
- Copper, Metal, Plastics
- Note
* Curing temperatures refer to the temperature in the actual bond line When choosing the respective curing conditions, time needed to heat the substrate has to be considered. Depending on the type of heat source (convection oven, hot stamp, heating plate) heat input may differ.. Polytec PU 1000 firstly sets by physical drying. Therefore curing time strongly depends on the type of substrate and bond line thickness. Thicker bond lines require longer curing times compared to thin bond lines, porous substrates accelerate the curing process.
- Markets
- Consumer Goods
- Electrical & Electronics
- Processing
Polytec PU 1000 can be dispensed directly from the syringe; For optimum storage stability we recommend storage in a fridge at 5 - 8°C However, the product needs to be prevented from freezing, prolonged storage above 25°C should be avoided; Plastic needles are preferred for dispensing, since steel needles are prone to clogging; Surfaces should be clean, thus free of dirt, grease, oil, dust or process chemicals
- Cure
- Air Dry
- Technology
- Ready-to-Use Products
- Standard Pack Sizes
3 cc / 5 g, 5 cc / 7 g, 10 cc / 17 g, 30 cc / 45 g; Customized Packaging
- Storage Stability (6-8°C)
- 6 Months
- Ready to Use Product Features
- Chemical Resistant
- Electrically Conductive
- Excellent Mechanical Strength
- Excellent Substrate Adhesion
- Flexible
- Compatible Substrates and Surfaces
- Copper
- Metal
- Plastics
Technical data
Table 1 of 3
4 rows| Characteristic | Value | Unit |
|---|---|---|
| Curing Time (100°C) | 5 - 10 | Minutes |
| Curing Time (180°C) | 2.0 | Seconds |
| Curing Time (23°C) | 0.5 - 4 | Hours |
| Curing Temperature | min. 15 | °C |
Table 2 of 3
9 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Degradation Temperature | 280.0 | °C | TM 302 |
| Elasticity Modulus | approx. 200 | N/mm² | TM 605 |
| Elongation at Break | approx. 1.2 | % | TM 605 |
| Hardness | 35.0 | Shore D | DIN EN ISO 868 |
| Specific Volume Resistivity | 2 - 4x10^-4 | Ohm-cm | TM 401 |
| Temperature Resistance Continuous | -40 to 100 | °C | TM 302 |
| Temperature Resistance Short Term | -40 to 200 | °C | TM 302 |
| Tensile Strength | approx. 8 | N/mm² | TM 605 |
| Thermal Conductivity | 1.8 | W/m.K | TM 502 |
Table 3 of 3
7 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Chemical Basis | Polyurethane Dispersion | — | — |
| Consistency | Creamy Paste | — | TM 101 |
| Density (Mix) | 1.72 | g/cm³ | TM 201.2 |
| Particle Size | max. 30 | μm | — |
| Number of Components | 1.0 | — | — |
| Type of Filler | Silver | — | — |
| Viscosity Mix (84s⁻¹, 23°C) | 12000.0 | mPa.s | TM 202.1 |
