Polytec TC 301
- Chemical Family
- Epoxy & Epoxy Derivatives
Polytec TC 301 is a standard single component metal filled, heat curing epoxy adhesive with excellent thermal conductivity. Polytec TC 301 was designed for all applications where heat transfer is essential (heat sinking, aluminum or ceramic packaging etc. It has a conveniently long pot and shelf life and is ideal for all dispensing and screen printing applications. TC 301 has an excellent adhesion on metals, ceramic, glass and most plastics. The material can be applied by dispensing or screen and stencil printing.
Properties
- Physical Form
- Paste
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Equipment & Parts
- Adhesives & Sealants
Product Families
- Other Adhesives & Sealants
Other characteristics
- Brand
- Polytec TC
- Cure Method
- Heat Cure
- Product Type
1K (1 component) Adhesive, Epoxy Adhesive, Solvent free (100% Solids) Adhesive; 1K (1 component) Adhesive; Epoxy Adhesive; Solvent free (100% Solids) Adhesive
- Application Area
- Heat Sink
- Compatible Substrates & Surfaces
- Ceramic, Glass, Metal, Plastics
- Note
*Curing temperatures refer to the temperature in the respective bond line. When choosing the respective curing conditions, the time needed to heat the substrate has to be considered. Depending on the type of heat source (convection oven, hot stamp, heating plate) the heat input may vary.
- Markets
- Consumer Goods
- Electrical & Electronics
- Industrial
- Processing
For two component products the components A and B should be mixed carefully within the specified mixing ratio; For filled products both components should be homogenized carefully prior mixing, in order to prevent a possible settling of the filler; Processing should be carried out rapidly after mixing the components as an indication the pot life can be used; Surfaces should be clean, thus free of dirt, grease, oil, dust or process chemicals; One component products can be applied directly and are not subject to a pot life (except pre mixed/frozen products); Please take notice of respective minimum curing temperature and time
- Cure
- Heat Cure
- Technology
- Ready-to-Use Products
- Pot Life (23°C)
- 1 Months
- Standard Pack Sizes
- 30cc / 60 g
- 250 g, 500 g
- 1 kg, 25 kg
- Customized Packaging
- Storage Stability (6-8°C)
- 6 Months
- Ready to Use Product Features
- Excellent Substrate Adhesion
- Good Thermal Conductivity
- Improved Heat Transfer Efficiency
- Long Potlife
- Long Shelf Life
- Thermally Conductive
- Compatible Substrates and Surfaces
- Ceramic
- Glass
- Metal
- Plastics
Technical data
Table 1 of 3
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Curing Time (120°C) | 50 - 55 | Minutes |
| Curing Time (150°C) | 10 - 15 | Minutes |
| Curing Temperature | min. 120 | °C |
Table 2 of 3
10 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Degradation Temperature | 350.0 | °C | TM 302 |
| Elongation at Break | 0.8 | % | TM 605 |
| Hardness | 85.0 | Shore D | DIN EN ISO 868 |
| Lap Shear Strength (Al/Al) | 23.0 | N/mm² | TM 604 |
| Temperature Resistance Continuous | -55 to 180 | °C | TM 302 |
| Temperature Resistance Short Term | -55 to 280 | °C | TM 302 |
| Tensile Strength | 59.0 | N/mm² | TM 605 |
| Thermal Conductivity | 1.7 - 2.1 | W/m.K | TM 502 |
| Water Absorption (24h, 23°C) | 0.2 | % | TM 301 |
| Young Modulus | 12000.0 | N/mm² | TM 605 |
Table 3 of 3
7 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Chemical Basis | Epoxy | — | — |
| Consistency | Creamy Paste | — | TM 101 |
| Density (Mix) | 2.0 | g/cm³ | TM 201.2 |
| Particle Size | max. 30 | μm | — |
| Number of Components | 1.0 | — | — |
| Type of Filler | Aluminium | — | — |
| Viscosity Mix (84s⁻¹, 23°C) | 43000.0 | mPa.s | TM 202.1 |
