Polytec TC 411
- Chemical Family
- Epoxy & Epoxy Derivatives
Polytec TC 411 is a pasty, two component epoxy with curing at room temperature, used for thermal management in electronics, hybrid technology, sensor technology and power engineering. Polytec TC 411 has a great thermal conductivity and an excellent adhesion to ceramic, glass, semiconductor materials, metals and most plastics. The application can be performed directly from the side-by-side cartridge with a static mixing nozzle, using a dispensing gun.
Properties
- Physical Form
- Paste
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Adhesives & Sealants
- Sensors & Actuators
Product Families
- Other Adhesives & Sealants
Other characteristics
- Brand
- Polytec TC
- Cure Method
- Air Dry
- Product Type
- 2K (2 component) Adhesive, Epoxy Adhesive
- 2K (2 component) Adhesive
- Epoxy Adhesive
- Application Method
- Gun
- Compatible Substrates & Surfaces
- Ceramic, Glass, Metal, Plastics
- Note
*Curing temperatures refer to the temperature in the respective bond line. When choosing the respective curing conditions, the time needed to heat the substrate has to be considered. Depending on the type of heat source (convection oven, hot stamp, heating plate) the heat input may vary.
- Markets
- Consumer Goods
- Electrical & Electronics
- Processing
The processing of two component products from side by side cartridges is very simple; The cartridge is inserted into a suitable dispensing gun. The closing cap of the cartridge is then removed and replaced by an according static mixing nozzle; By activating the trigger of the dispensing gun, the two components are pressed out and automatically mixed in the static mixer; In order to prevent mixing errors, dispose the first half of the content in the mixing nozzel prior to application; Processing should be carried out rapidly after mixing the components as an indication, the pot life can be used; When the pot life is exceeded, the mixing tube should be replaced with a new one; Close the cartridge with the cap after use; Surfaces should be clean, thus free of dirt, grease, oil, dust or process chemicals; Please take care of respective minimum curing temperature and time
- Shelf LIfe
- 12 months at 23°C
- Cure
- Air Dry
- Technology
- Ready-to-Use Products
- Pot Life (23°C)
- 12 Minutes
- Application Methods
- Gun
- Standard Pack Sizes
- 50 mL 2K cartridges
- Customized Packaging
- Ready to Use Product Features
- Ease of Handling
- Excellent Substrate Adhesion
- Flexible
- Heat Resistance
- Thermally Conductive
- Compatible Substrates and Surfaces
- Ceramic
- Glass
- Metal
- Plastics
Technical data
Table 1 of 3
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Curing Time (23°C) | 48.0 | Hours |
| Curing Time (80°C) | 90.0 | Minutes |
| Curing Temperature | min. 15 | °C |
Table 2 of 3
10 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Degradation Temperature | 280.0 | °C | TM 302 |
| Elongation at Break | 11.0 | % | TM 605 |
| Glass Transition Temperature (Tg) | max. 20 | °C | TM 501 |
| Hardness | 38.0 | Shore D | DIN EN ISO 868 |
| Lap Shear Strength (Al/Al) | 7.0 | N/mm² | TM 604 |
| Maximum Service Temperature (Continuous) | -55 to 120 | °C | TM 302 |
| Maximum Service Temperature (Short-Term) | -55 to 220 | °C | TM 302 |
| Tensile Strength | 3.0 | N/mm² | TM 605 |
| Thermal Conductivity | 1.3 - 1.5 | W/m.K | TM 502 |
| Young's Modulus | N.B | N/mm² | TM 605 |
Table 3 of 3
9 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Chemical Basis | Epoxy | — | — |
| Consistency | Creamy paste | — | TM 101 |
| Density (A-Part) | 1.5 | g/cm³ | TM 201.2 |
| Density (B-Part) | 1.3 | g/cm³ | TM 201.2 |
| Density (Mix) | 1.5 | g/cm³ | TM 201.2 |
| Mixing Ratio (Volume) | 7260 | — | — |
| Number of Components | 2.0 | — | — |
| Type of Filler | Boron nitride | — | — |
| Viscosity Mix (84s⁻¹, 23°C) | 140000.0 | mPa.s | TM 202.1 |
