Polytec EC 244
- Chemical Family
- Epoxy & Epoxy Derivatives
Polytec EC 244 is a standard two-component, solvent-free, electrically conductive epoxy adhesive with a short pot life and curing at room temperatures. Polytec EC 244 is suggested for short time processing and low temperature curing applications. Polytec EC 244 can be also cured at 50°C in 1h. The material can be applied by dispensing or manually.
Properties
- Physical Form
- Paste
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Adhesives & Sealants
Product Families
- Conductive Adhesives
Other characteristics
- Brand
- Polytec EC
- Cure Method
- Air Dry
- Product Type
2K (2 component) Adhesive, Conductive Adhesive, Epoxy Adhesive, Solvent free (100% Solids) Adhesive; 2K (2 component) Adhesive; Conductive Adhesive; Epoxy Adhesive; Solvent free (100% Solids) Adhesive
- Note
*Curing temperatures refer to the temperature in the respective bond line. When choosing the respective curing conditions, the time needed to heat the substrate has to be considered. Depending on the type of heat source (convection oven, hot stamp, heating plate) the heat input may vary.
- Markets
- Consumer Goods
- Electrical & Electronics
- Processing
For two component products the components A and B should be mixed carefully within the specified mixing ratio; For filled products both components should be homogenized carefully prior mixing, in order to prevent a possible settling of the filler; Processing should be carried out rapidly after mixing the components as an indication the pot life can be used; Surfaces should be clean, thus free of dirt, grease, oil, dust or process chemicals; One component products can be applied directly and are not subject to a pot life (except pre mixed/frozen products); Please take notice of respective minimum curing temperature and time
- Cure
- Air Dry
- Technology
- Ready-to-Use Products
- Pot Life (23°C)
- 15 Minutes
- Standard Pack Sizes
- 30 g, 250 g, 500 g
- Customized Packaging
- Storage Stability (23°C)
- 12 Months
- Ready to Use Product Features
- Electrically Conductive
- Long Potlife
Technical data
Table 1 of 3
4 rows| Characteristic | Value | Unit |
|---|---|---|
| Curing Time (23°C) | 24.0 | Hours |
| Curing Time (50°C) | 60.0 | Minutes |
| Curing Time (80°C) | 15.0 | Minutes |
| Curing Temperature | min. 23 | °C |
Table 2 of 3
8 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Elasticity Modulus | 4800.0 | N/mm² | TM 605 |
| Elongation at Break | 0.7 | % | TM 605 |
| Hardness | 70.0 | Shore D | DIN EN ISO 868 |
| Lap Shear Strength (Al/Al) | 7.8 | N/mm² | TM 604 |
| Specific Volume Resistivity | max. 5x10^-3 | Ohm-cm | DIN EN ISO 3915 |
| Temperature Resistance Continuous | -40 to 150 | °C | TM 302 |
| Temperature Resistance Short Term | 180.0 | °C | TM 302 |
| Tensile Strength | 27.0 | N/mm² | TM 605 |
Table 3 of 3
10 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Chemical Basis | Epoxy | — | — |
| Consistency | Creamy Paste | — | TM 101 |
| Density (Mix) | 2.96 | g/cm³ | TM 201.2 |
| Particle Size | max. 40 | μm | — |
| Mixing Ratio (Weight) | 1900-01-03T04:10:00+00:00 | — | — |
| Number of Components | 2.0 | — | — |
| Type of Filler | Silver | — | — |
| Viscosity Mix (84s⁻¹, 23°C) | 9000.0 | mPa.s | TM 202.1 |
| Viscosity A-Part (10s⁻¹, 23°C) | 180000.0 | mPa.s | TM 202.4 |
| Viscosity B Part (84s⁻¹, 23°C) | 600.0 | mPa.s | TM 202.1 |
