Polytec EC 101
- Chemical Family
- Epoxy & Epoxy Derivatives
Polytec EC 101 is a standard two-component, solvent free, heat curing epoxy resin with a long pot life and excellent electrical conductivity. It is used for high volume chip and substrate bonding, in micro-electronic, medical, hybrids and optoelectronic application. Polytec EC 101 is certified to USP Class VI Biocompatibility Standards. Polytec EC 101 can be cured at 95°C or in rapid cure cycles at higher temperatures. The material can be applied by dispensing, jet-dispensing or manually.
Properties
- Physical Form
- Paste
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Medical Tapes & Adhesives
- Adhesives & Sealants
- Semiconductor Manufacturing
Product Families
- Conductive Adhesives
Other characteristics
- Brand
- Polytec EC
- Cure Method
- Heat Cure
- Product Type
2K (2 component) Adhesive, Conductive Adhesive, Epoxy Adhesive, Solvent free (100% Solids) Adhesive; 2K (2 component) Adhesive; Conductive Adhesive; Epoxy Adhesive; Solvent free (100% Solids) Adhesive
- Application Area
- Die/Chip Attach
- Note
*Curing temperatures refer to the temperature in the respective bond line. When choosing the respective curing conditions, the time needed to heat the substrate has to be considered. Depending on the type of heat source (convection oven, hot stamp, heating plate) the heat input may vary.
- Markets
- Consumer Goods
- Electrical & Electronics
- Healthcare & Pharma
- Processing
For two component products the components A and B should be mixed carefully within the specified mixing ratio; For filled products both components should be homogenized carefully prior mixing, in order to prevent a possible settling of the filler; Processing should be carried out rapidly after mixing the components as an indication the pot life can be used; Surfaces should be clean, thus free of dirt, grease, oil, dust or process chemicals; One component products can be applied directly and are not subject to a pot life (except pre mixed/frozen products); Please take notice of respective minimum curing temperature and time
- Cure
- Heat Cure
- Technology
- Ready-to-Use Products
- Labeling Claims
- Biocompatible
- Pot Life (23°C)
- 48 Hours
- Standard Pack Sizes
- 30 g, 250 g, 500 g
- Customized Packaging
- Storage Stability (6-8°C)
- 12 Months
- Certifications and Compliance
- USP Class VI
- Ready to Use Product Features
- Biocompatible
- Electrically Conductive
- Good Bonding Strength
- High Temperature Curing
- Long Potlife
- Soft
Technical data
Table 1 of 3
6 rows| Characteristic | Value | Unit |
|---|---|---|
| Curing Time (100°C) | 50.0 | Minutes |
| Curing Time (120°C) | 15 - 20 | Minutes |
| Curing Time (130°C) | 7.0 | Minutes |
| Curing Time (150°C) | 3 - 4 | Minutes |
| Curing Time (180°C) | 60.0 | Seconds |
| Curing Temperature | min. 95 | °C |
Table 2 of 3
15 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Coefficient of Thermal Expansion (<Tg) | 40.0 | ppm | ISO 11359-2 |
| Coefficient of Thermal Expansion (>Tg) | 114.0 | ppm | ISO 11359-2 |
| Degradation Temperature | 400.0 | °C | TM 302 |
| Elasticity Modulus | 7000.0 | N/mm² | TM 605 |
| Electrical Conductivity | 1 - 0.25x10⁶ | S/m | DIN EN ISO 3915 |
| Elongation at Break | 0.5 | % | TM 605 |
| Glass Transition Temperature (Tg) | 74.0 | °C | TM 501 |
| Hardness | 85.0 | Shore D | DIN EN ISO 868 |
| Lap Shear Strength (Al/Al) | 8.0 | N/mm² | TM 604 |
| Specific Volume Resistivity | 1 - 4x10^-4 | Ohm-cm | DIN EN ISO 3915 |
| Temperature Resistance Continuous | -55 to 200 | °C | TM 302 |
| Temperature Resistance Short Term | -55 to 300 | °C | TM 302 |
Table 3 of 3
13 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Chemical Basis | Epoxy | — | — |
| Consistency | Creamy Paste | — | TM 101 |
| Density (A-Part) | 2.17 | g/cm³ | TM 201.2 |
| Density (B-Part) | 3.34 | g/cm³ | TM 201.2 |
| Density (Mix) | 2.75 | g/cm³ | TM 201.2 |
| Particle Size | max. 30 | μm | — |
| Mixing Ratio (Volume) | 1900-01-03T05:05:00+00:00 | — | — |
| Mixing Ratio (Weight) | 3660 | — | — |
| Number of Components | 2.0 | — | — |
| Type of Filler | Silver | — | — |
| Viscosity Mix (84s⁻¹, 23°C) | 12000.0 | mPa.s | TM 202.1 |
| Viscosity A-Part (84s⁻¹, 23°C) | 15000.0 | mPa.s | TM 202.1 |
