Polytec EC 151-L
- Chemical Family
- Epoxy & Epoxy Derivatives
Polytec EC 151-L is a standard two- component, solvent free epoxy resin optimized for stamping application, with a long pot life, high temperature stability and excellent electrical conductivity. It can be used for high volume chip and substrate bonding, in micro-electronic, hybrid and optoelectronic application. Polytec EC 151-L can be cured at 95°C or allows rapid cure cycles at higher temperatures and will withstand reflow and wire bond processes. The material can be applied by stamping, (jet-) dispensing or manually.
Properties
- Physical Form
- Paste
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Consumer Goods — Stationery
- Art & Office Supplies
- Medical Tapes & Adhesives
- Adhesives & Sealants
- Semiconductor Manufacturing
Product Families
- Conductive Adhesives
Other characteristics
- Brand
- Polytec EC
- Cure Method
- Heat Cure
- Product Type
2K (2 component) Adhesive, Conductive Adhesive, Epoxy Adhesive, Solvent free (100% Solids) Adhesive; 2K (2 component) Adhesive; Conductive Adhesive; Epoxy Adhesive; Solvent free (100% Solids) Adhesive
- Application Area
- Die/Chip Attach, Stamping
- Die/Chip Attach
- Stamping
- Note
*Curing temperatures refer to the temperature in the respective bond line. When choosing the respective curing conditions, the time needed to heat the substrate has to be considered. Depending on the type of heat source (convection oven, hot stamp, heating plate) the heat input may vary.
- Markets
- Consumer Goods
- Electrical & Electronics
- Healthcare & Pharma
- Processing
For two component products the components A and B should be mixed carefully within the specified mixing ratio; For filled products both components should be homogenized carefully prior mixing, in order to prevent a possible settling of the filler; Processing should be carried out rapidly after mixing the components as an indication the pot life can be used; Surfaces should be clean, thus free of dirt, grease, oil, dust or process chemicals; One component products can be applied directly and are not subject to a pot life (except pre mixed/frozen products); Please take notice of respective minimum curing temperature and time
- Cure
- Heat Cure
- Technology
- Ready-to-Use Products
- Pot Life (23°C)
- 48 Hours
- Standard Pack Sizes
- 30 g, 250 g, 500 g
- Customized Packaging
- Storage Stability (23°C)
- 12 Months
- Ready to Use Product Features
- Biocompatible
- Electrically Conductive
- Good Bonding Strength
- Good Thermal Stability
- High Temperature Curing
- Long Potlife
- Soft
Technical data
Table 1 of 3
5 rows| Characteristic | Value | Unit |
|---|---|---|
| Curing Time (100°C) | 60.0 | Minutes |
| Curing Time (120°C) | 15.0 | Minutes |
| Curing Time (150°C) | 5.0 | Minutes |
| Curing Time (180°C) | 60.0 | Seconds |
| Curing Temperature | min. 95 | °C |
Table 2 of 3
12 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Coefficient of Thermal Expansion (<Tg) | 40.0 | ppm | ISO 11359-2 |
| Coefficient of Thermal Expansion (>Tg) | 114.0 | ppm | ISO 11359-2 |
| Degradation Temperature | 400.0 | °C | TM 302 |
| Elasticity Modulus | 7000.0 | N/mm² | TM 605 |
| Elongation at Break | 0.5 | % | TM 605 |
| Glass Transition Temperature (Tg) | 75.0 | °C | TM 501 |
| Hardness | 85.0 | Shore D | DIN EN ISO 868 |
| Specific Volume Resistivity | 3 - 6x10^-4 | Ohm-cm | DIN EN ISO 3915 |
| Temperature Resistance Continuous | -55 to 200 | °C | TM 302 |
| Temperature Resistance Short Term | -55 to 300 | °C | TM 302 |
| Tensile Strength | 32.0 | N/mm² | TM 605 |
| Water Absorption (24h, 23°C) | 0.4 | % | TM 301 |
Table 3 of 3
10 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Chemical Basis | Epoxy | — | — |
| Consistency | Creamy Paste | — | TM 101 |
| Density (Mix) | 2.81 | g/cm³ | TM 201.2 |
| Particle Size | max. 40 | μm | — |
| Mixing Ratio (Weight) | 3660 | — | — |
| Number of Components | 2.0 | — | — |
| Type of Filler | Silver | — | — |
| Viscosity Mix (84s⁻¹, 23°C) | 5000.0 | mPa.s | TM 202.1 |
| Viscosity A-Part (84s⁻¹, 23°C) | 7500.0 | mPa.s | TM 202.1 |
| Viscosity B Part (84s⁻¹, 23°C) | 6000.0 | mPa.s | TM 202.1 |
