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Cosmic Epoxy E484
- Chemical Family
- Epoxy & Epoxy Derivatives
Cosmic Epoxy E484 is a mineral-filled, glass-reinforced, electrical-grade epoxy molding compound supplied in granular form. It boasts excellent mechanical strength and electrical properties, particularly at high temperatures, and has successfully passed NASA outgassing tests. This compound finds applications in electrical hardware, including underwater connectors and various insulation needs.
Properties
- Physical Form
- Granules
- Solid
Product families
Applications
Electrical & Electronics — Parts & Components
- Connectors
Electrical & Electronics — Wire & Cable
- Jacketing & Insulation
Product Families
Plastics — Thermoset Resins
- Epoxies
Other characteristics
- Brand
- Cosmic Epoxy
- End Uses
- Connectors, Electrical Insulation
- Polymer Name
- Epoxy Resins & Compounds
- Flexural Strength
- 130.91 MPa
- Volume Resistivity
- 100,000,000.0 Ohm-m
- Markets
- Electrical & Electronics
- Flame Rating
- UL 94 V0
- Key Features
It has excellent mechanical strength and electrical properties, especially at high temperatures. It has passed NASA out-gassing tests.
- Technology
- Plastics
- Fillers Included
- Glass/Mineral
- Material Features
- Excellent Mechanical Strength
- Good Electrical Properties
- Low Odor
- Applications
Used in electrical hardware applications such as underwater connectors and other insulation applications.
- Certifications and Compliance
- ISO 9001
- UL 94
- Plastics and Elastomers End Uses
- Connectors
- Electrical Insulation
- Plastics and Elastomers Functions
- Resin
Technical data
Table 1 of 6
6 rows| Characteristic | Value | Unit |
|---|---|---|
| Flexural Strength | 19000 | psi |
| Flexural Modulus | 2.6 x 10⁶ | psi |
| Compressive Strength | 30000 | psi |
| Tensile Strength | 14000 | psi |
| Barcol Hardness | 65 - 75 | — |
| Impact Strength (Izod Notched) | 0.6 | ft-lb / inch |
Table 2 of 6
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Heat Deflection Temperature | 260 | °C |
| Glass Transition Temperature (Tg) | 165 | °C |
| Thermal Conductivity | 10 x 10⁻⁴ | cal/sec/cm²/°C/cm |
Table 3 of 6
9 rows| Characteristic | Value | Unit |
|---|---|---|
| Arc Resistance | 186 | seconds |
| Volume Resistance | min. 10¹⁰ | Ohm - cm |
| Surface Resistance | 1 x 10¹⁵ | Ohm - cm |
| Dielectric Strength (Kv Step-by-Step, Wet) | 350 | volts/mil |
| Dielectric Breakdown (Step-by-Step, Wet) | 60 | Kv |
| Dielectric Constant (at 1 KHz, Wet) | 5.4 | — |
| Dissipation Factor (at 1KHz, Wet) | 0.011 | — |
| Dielectric Constant (at 1 MHz, Wet) | 4.7 | — |
| Dissipation Factor (at 1MHz, Wet) | 0.008 | — |
Table 4 of 6
2 rows| Characteristic | Value | Unit |
|---|---|---|
| Linear Thermal Expansion (Alpha 1) | 29 x 10⁻⁶ | in/in/°C |
| Linear Thermal Expansion (Alpha 2) | 92 x 10⁻⁶ | in/in/°C |
Table 5 of 6
1 row| Characteristic | Value | Unit |
|---|---|---|
| Water Absorption (at 50 °C,48 hours) | 0.25 | % |
Table 6 of 6
7 rows| Characteristic | Value | Unit |
|---|---|---|
| Specific Gravity | 1.8 | — |
| Bulk Factor | 2.0 - 5.0 | — |
| Molding Pressure | 500 - 8,000 | psi |
| Molding Pressure | 35 - 562 | Kg/cm² |
| Molding Temperature | 150 - 180 | °C |
| Molding Temperature | 302 - 356 | °F |
| Mold Shrinkage | 0.002 - 0.004 | In / In |
