Farboset® 2461
- Chemical Family
- Epoxy & Epoxy Derivatives
Farboset® 2461 is a mineral-filled novolac epoxy molding compound that offers fast cure rates, excellent moldability, and superior thermal shock and moisture resistance. It has been formulated to achieve a high glass transition temperature, making it suitable for applications requiring optimal reliability performance, even in very thin sections. Farboset® 2461 is designed for encapsulating a wide range of electronic devices, including capacitors, resistors, resistor networks, and inductor coils, ensuring their protection and reliability in various operating conditions.
Product families
Applications
- Potting Compounds
- Other Parts & Components
Product Families
- Epoxies
Other characteristics
- Brand
- Farboset
- End Uses
Capacitors, Encapsulant, Inductor Coil, Resistor, Resistor Network
- Polymer Name
- Epoxy Resins & Compounds
- Flexural Strength
- 85.436 - 85.436 MPa
- Volume Resistivity
- 22000000000000.0 - 22000000000000.0 Ohm-m
- Markets
- Electrical & Electronics
- Shelf LIfe
- 6 months
- Flame Rating
- UL 94 V0
- Technology
- Plastics
- Fillers Included
- Mineral
- Material Features
- Fast Curing
- Good Moldability
- High Glass Transition Temperature
- High Moisture Resistance
- Low Odor
- Thermal Shock Resistant
- Applications
This compound was especially formulated to achieve a high glass transition temperature for optimum reliability performance in very thin sections. It is designed to encapsulate a wide range of devices including capacitors, resistors, resistor networks and inductor coils.
- Certifications and Compliance
- ISO 9001
- UL 94
- Plastics and Elastomers End Uses
- Capacitors
- Encapsulant
- Inductor Coil
- Resistor
- Resistor Network
- Plastics and Elastomers Functions
- Resin
Technical data
Table 1 of 4
6 rows| Characteristic | Value | Unit |
|---|---|---|
| Tensile Strength | 8200 | psi |
| Tensile Strength | 580 | kg/cm² |
| Flexural Strength | 12400 | psi |
| Flexural Strength | 873 | kg/cm² |
| Compressive Strength | 34200 | psi |
| Compressive Strength | 2400 | kg/cm² |
Table 2 of 4
4 rows| Characteristic | Value | Unit |
|---|---|---|
| Glass Transition Temperature (Tg) | 163 | °C |
| Linear Thermal Expansion (Alpha 1) | 27x 10⁻⁶ | cm/cm/°C |
| Linear Thermal Expansion (Alpha 2) | 60x 10⁻⁶ | cm/cm/°C |
| Thermal Conductivity | 23x10⁻⁴ | cal/cm-sec-°C |
Table 3 of 4
6 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Arc Resistance | 194 | seconds | — |
| Dissipation Factor (1 KHz) | 0.012 | — | ASTM 150 |
| Dielectric Constant (1 KHz) | 5.12 | — | — |
| Dielectric Strength (1/4 Inch Section) | 387 | volts/mil | — |
| Surface Resistivity | min. 1.5x 10¹⁶ | ohm-cm | — |
| Volume Resistivity | 2.2x 10¹⁵ | Ohm - cm | — |
Table 4 of 4
10 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Bulk Density | 0.9 | gm/cc | — |
| Molding Pressure | 14 - 70 | kg/cm² | — |
| Molding Pressure | 200 - 1,000 | psi | — |
| Molding Temperature | 145 - 180 | °C | — |
| Molding Temperature | 293 - 356 | °F | — |
| Mold Shrinkage | 0.004 | cm/cm | — |
| Cure Time (at 150°C) | 1 - 2 | minutes | — |
| Post Cure (at 150°C) | 4 | hours | — |
| Molded Density | 2.08 | gm/cc | — |
| Spiral Flow | 76 | cm | EMMI 1-66A |
