Farboset® 2220
- Chemical Family
- Epoxy & Epoxy Derivatives
Farboset® 2220 is a granular, mineral-filled, novolac epoxy molding compound known for its excellent moldability, fast cure rate, and strong physical and electrical properties. It is specially designed for high-performance applications that demand enhanced thermal characteristics. These applications include the encapsulation of bushings, insulators, and various electrical and electronic components. The compound's properties make it a reliable choice for protecting and ensuring the performance of critical components in challenging environments.
Properties
- Physical Form
- Granules
- Solid
Product families
Applications
- Potting Compounds
Product Families
- Epoxies
Other characteristics
- Brand
- Farboset
- End Uses
- Bushings, Encapsulant, Insulators
- Polymer Name
- Epoxy Resins & Compounds
- Markets
- Electrical & Electronics
- Shelf LIfe
- 2 days - 6 months
- Technology
- Plastics
- Fillers Included
- Mineral
- Material Features
- Enhanced Physical Properties
- Fast Curing
- Good Electrical Properties
- Good Moldability
- Good Thermal Stability
- High Performance
- Low Odor
- Applications
It is designed for high performance applications requiring improved thermal characteristics, such as the encapsulation bushings, insulators and other electrical and electronic components.
- Certifications and Compliance
- ISO 9001
- Plastics and Elastomers End Uses
- Bushings
- Encapsulant
- Insulators
- Plastics and Elastomers Functions
- Resin
Technical data
Table 1 of 4
9 rows| Characteristic | Value | Unit |
|---|---|---|
| Flexural Strength | 18000.0 | psi |
| Flexural Strength | 1260.0 | kg/cm² |
| Compressive Strength | 40000.0 | psi |
| Compressive Strength | 2800.0 | kg/cm² |
| Tensile Strength | 11500.0 | psi |
| Tensile Strength | 809.0 | kg/cm² |
| Hardness (Shore D) | 90.0 | — |
| Impact Strength (Izod Notched) | 0.022 | kg-m/cm |
| Impact Strength (Izod Notched) | 0.4 | ft-Ib/inch |
Table 2 of 4
5 rows| Characteristic | Value | Unit |
|---|---|---|
| Thermal Conductivity | 22 x 10⁻⁴ | cal/cm-sec-°C |
| Heat Distortion Temperature (at 18.6 kg/cm²) | 165.0 | °C |
| Heat Distortion Temperature (at 264 psi) | 329.0 | °F |
| Maximum Intermittent Operating Temperature | 200.0 | °C |
| Hot Plate Cure Time (at 150 °C) | 45.0 | seconds |
Table 3 of 4
7 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Arc Resistance | 220.0 | seconds | — |
| Dissipation Factor (1 KHz) | 0.006 | — | ASTM 150 |
| Dielectric Constant (1 KHz) | 4.3 | — | — |
| Dielectric Strength (Short Time, 125 mils) | 400.0 | volts/mil | — |
| Loss Factor (1 KHz) | 0.026 | — | ASTM 150 |
| Volume Resistivity | 1.0 x 10¹⁵ | Ohm - cm | — |
| Surface Resistivity | 1.0 x 10¹⁶ | ohm-cm | — |
Table 4 of 4
9 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Bulk Density | 1.0 | gm/cc | — |
| Molding Pressure | 14 - 70 | kg/cm² | — |
| Molding Pressure | 200 - 1,000 | psi | — |
| Molding Temperature | 150 - 180 | °C | — |
| Molding Temperature | 302 - 356 | °F | — |
| Mold Shrinkage | 0.005 | cm/cm | — |
| Cure Time (at 150°C) | 1 - 2 | minutes | — |
| Molded Density | 2.05 | gm/cc | — |
| Spiral Flow | 51.0 | cm | EMMI 1-66A |
