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Farboset® 2220

Farboset® 2220 is a granular, mineral-filled, novolac epoxy molding compound known for its excellent moldability, fast cure rate, and strong physical and electrical properties. It is specially designed for high-performance applications that demand enhanced thermal characteristics. These applications include the encapsulation of bushings, insulators, and various electrical and electronic components. The compound's properties make it a reliable choice for protecting and ensuring the performance of critical components in challenging environments.

Properties

Physical Form
  • Granules
  • Solid

Product families

Applications

Electrical & Electronics — Packaging & Assembly
  • Potting Compounds

Product Families

Plastics — Thermoset Resins
  • Epoxies

Other characteristics

Brand
Farboset
End Uses
Bushings, Encapsulant, Insulators
Polymer Name
Epoxy Resins & Compounds
Markets
Electrical & Electronics
Shelf LIfe
2 days - 6 months
Technology
Plastics
Fillers Included
Mineral
Material Features
  • Enhanced Physical Properties
  • Fast Curing
  • Good Electrical Properties
  • Good Moldability
  • Good Thermal Stability
  • High Performance
  • Low Odor
Applications

It is designed for high performance applications requiring improved thermal characteristics, such as the encapsulation bushings, insulators and other electrical and electronic components.

Certifications and Compliance
ISO 9001
Plastics and Elastomers End Uses
  • Bushings
  • Encapsulant
  • Insulators
Plastics and Elastomers Functions
Resin

Technical data

Table 1 of 4

9 rows
CharacteristicValueUnit
Flexural Strength18000.0psi
Flexural Strength1260.0kg/cm²
Compressive Strength40000.0psi
Compressive Strength2800.0kg/cm²
Tensile Strength11500.0psi
Tensile Strength809.0kg/cm²
Hardness (Shore D)90.0—
Impact Strength (Izod Notched)0.022kg-m/cm
Impact Strength (Izod Notched)0.4ft-Ib/inch

Table 2 of 4

5 rows
CharacteristicValueUnit
Thermal Conductivity22 x 10⁻⁴cal/cm-sec-°C
Heat Distortion Temperature (at 18.6 kg/cm²)165.0°C
Heat Distortion Temperature (at 264 psi)329.0°F
Maximum Intermittent Operating Temperature200.0°C
Hot Plate Cure Time (at 150 °C)45.0seconds

Table 3 of 4

7 rows
CharacteristicValueUnitMethod
Arc Resistance220.0seconds—
Dissipation Factor (1 KHz)0.006—ASTM 150
Dielectric Constant (1 KHz)4.3——
Dielectric Strength (Short Time, 125 mils)400.0volts/mil—
Loss Factor (1 KHz)0.026—ASTM 150
Volume Resistivity1.0 x 10¹⁵Ohm - cm—
Surface Resistivity1.0 x 10¹⁶ohm-cm—

Table 4 of 4

9 rows
CharacteristicValueUnitMethod
Bulk Density1.0gm/cc—
Molding Pressure14 - 70kg/cm²—
Molding Pressure200 - 1,000psi—
Molding Temperature150 - 180°C—
Molding Temperature302 - 356°F—
Mold Shrinkage0.005cm/cm—
Cure Time (at 150°C)1 - 2minutes—
Molded Density2.05gm/cc—
Spiral Flow51.0cmEMMI 1-66A

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