BONDiT™ B-755
- Chemical Family
- Epoxy & Epoxy Derivatives
BONDiT™ B-755 is a unique low viscosity, two-part, high strength, 100% solids, room-temperature curing semi-rigid cyclo-aliphatic epoxy resin system with good scratch and impact resistance. Suitable for clear coat, conformal coating and electrical potting applications. The B-755 handles harsh environments easily and is effective against moisture, salt water, acids, alkalies, oils, fuels, solvents and detergents. B-755 produces very low extract products in soak tests and provides corrosion resistance.
Other characteristics
- Brand
- BONDiT
- Cure Method
- Air Dry, Heat Cure
- Product Type
2K (2 component) Coating, Clearcoat, Epoxy Coating, Solventless & High Solids Coating; 2K (2 component) Coating; Clearcoat; Epoxy Coating; Solventless & High Solids Coating
- Application Area
Electrical Components, Marine Applications, Mining Operations; Electrical Components; Marine Applications; Mining Operations
- Application Method
- Brush, Roller, Spray
- Compatible Substrates & Surfaces
- Elastomers & Rubbers, Metal
- Markets
- Adhesives & Sealants
- Automotive & Transportation
- Consumer Goods
- Electrical & Electronics
- Industrial
- Storage
BONDiTTM B-755 is available in side-by-side handheld and pneumatic actuated gun cartridges, quarts, gallons, pails and drums. Custom packaging, such as premixed and degassed frozen cartridges, is also available
- Easy to Use
Two-part, primerless, ambient cure system with low HAZMAT impact for work environment. Available in handheld and pneumatic gun actuated cartridges, quarts, gallons and drums.
- Cure
- Air Dry
- Heat Cure
- Coating Type
- 2K (2 component) Coating
- Clearcoat
- Conformal Coating
- Solventless & High Solids Coating
- Curing Guide
Ambient cure (10 gram mix): 60 minute pot life; 90 minute gel time, 2 hours set time, 7 hours to 85% cure, dust free and may be roughly handled. Thin film ambient set time of 90 minutes and cure of 5 hours. Thermal cure at 135degF is approximately 10 minute. In 100gr quantity B-755 is exothermic which will shorten pot life. Mix part A with part B, 4:1 ratio by volume or 100/23.1 by weight. Thoroughly hand mix at least 4 minutes, or use static mixer. Degass is recommended. Optional surface prep will improve adhesion by abrading or grit blasting substrates with #100 AlOx followed by degrease and/or alcohol wipe. The usable shelf life of unopened containers of BONDiTTM B-755 resin is one year, and should be stored in cool, dry place. When not in use, containers should be kept tightly closed. Not UV sensitive; keep away from excess heat.
- Product Info
BONDiT B-755 exhibits superior thermal resistance compared to most epoxy systems, particularly those offering ambient curing temperature. DMA testing demonstrate stability to 600°F. Excellent for fuel cell applications. Apply B-755 by static mixer, brush or roller. B-755 is very easy to use with low HAZMAT impact as a 100% solids epoxy system–no solvents or VOC problems.
- Technology
- Ready-to-Use Products
- Packaging Type
- Cartridges
- Drums
- Labeling Claims
- VOC-free
- High Performance
High temperature to 600 °F, excellent chemical resistance, high strength even with ambient cure. rugged semi-rigid system. The product is also available in the filled (thixotropic). Bonds to many substrates such as GRE circuit boards and FKM elastomer
