BONDiT™ B-521
- Chemical Family
- Epoxy & Epoxy Derivatives
BONDiT™ B-521 is a two-part, state-of-the-art 100% solids, elevated-temperature, fast curing, semi-flexible epoxy resin system. Especially designed for adhesive applications in bonding engineering plastics and elastomers to various substrates–particularly rigid substrates such as glass, metals and ceramic, without stress build up and joint or substrate fracture.
Other characteristics
- Brand
- BONDiT
- Cure Method
- Heat Cure
- Product Type
2K (2 component) Adhesive, 2K (2 component) Coating, 2K (2 component) Sealant, Epoxy Coating, Solvent free (100% Solids) Adhesive, Solvent free (100% Solids) Sealant, Solventless & High Solids Coating, Structural Adhesive, Structural Sealant
- Application Area
Electrical Components, Marine Applications, Mining Operations
- Application Method
- Brush, Roller
- Compatible Substrates & Surfaces
- Ceramic, Elastomers & Rubbers, Glass, Plastics
- Markets
- Adhesives & Sealants
- Automotive & Transportation
- Consumer Goods
- Electrical & Electronics
- Industrial
- Storage
A wide range of curing regimes may be employed: ambient set in 4 hours, tack free in 12 hours, and 95% cure in 24 hours. Post curing at 150°F, after 2 hours at ambient to allow bubble escape, will cure 98% in 4 hours, or 2 hours at 200°F.
