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United Adhesives ET1642

United Adhesives ET1642 is a high thermally conductive epoxy potting adhesive.

Product families

Applications

Automotive & Transportation — Automotive
  • Electrical & Electronic Systems
Electrical & Electronics — Parts & Components
  • Printed Circuit Boards (PCBs)
  • Semiconductor Manufacturing
Automotive & Transportation — Transportation
  • Aerospace & Aviation
Electrical & Electronics — Wire & Cable
  • Optical Fiber & Telecom

Product Families

Ready-to-Use Products — Adhesives & Sealants
  • Conductive Adhesives

Other characteristics

Cure Method
Heat Cure
Product Type

2K (2 component) Adhesive, Conductive Adhesive, Epoxy Adhesive, Potting Compound; 2K (2 component) Adhesive; Conductive Adhesive; Epoxy Adhesive; Potting Compound

Application Area

Aerospace Applications, Electronic Components, Heat Sink, Semiconductors, Telecommunications Applications; Aerospace Applications; Electronic Components; Heat Sink; Semiconductors; Telecommunications Applications

Compatible Substrates & Surfaces
Aluminum, Copper, Metal
Color
Grey
Safety
General hygiene regulations should be observed.
Markets
  • Automotive & Transportation
  • Electrical & Electronics
Storage

ET 1642 has a shelf life of at least 6 months when stored below 35°C in the originally sealed container. The 'Best use before end' date of each batch appears on the product label. Storage beyond the date specified on the label does not necessarily mean that the product is no longer usable. In this case however, the properties required for the intended use must be checked for quality assurance reasons.

Cure
Heat Cure
Technology
Ready-to-Use Products
Characteristic

ET 1642 is an epoxy-based high thermally conductive structural bonding adhesive for electronic applications. It is a two-component, flowable, addition-curing system that cures at room temperature or elevated temperature to provide strong bonding to metals such as aluminum, copper, and FR4 based printed circuit board with excellent thermal conductivity. The cured material also has very low CTE for better thermal cycle performances. ET 1642 is dispensable.

Typical Applications
  • Aerospace electronics
  • Automotive electronics
  • Semiconductor and Telecommunications
  • Thermally conductive potting
  • Bonding of power devices to heat sinks
  • Thermally conductive structural bonding
  • Thermally conductive vibration
Processing Instruction

Important! Only components A and B with the same lot number may be processed together! For the package in a container (not in a cartridge), to ensure homogeneity of the material, the components must be stirred thoroughly before they are removed or processed in order to uniformly disperse any fillers that might have settled during storage. For long-term storage, it is recommended to store the material in –40°C freezer to prevent filler from settling.. We recommend running preliminary tests to optimize conditions for the particular application. Comprehensive processing instructions can be obtained by contacting directly to United Adhesives, Inc.

Special Features and Benefits
  • High thermal conductivity & ambient curable
  • High temperature stability
  • Low CTE for stress compliance
  • Low bleeding, low volatile
  • Low ionic content
Ready to Use Product Features
  • Good Flow
  • Good Thermal Conductivity
  • Good Thermal Stability
  • High Temperature Curing
  • Low Bleeding
  • Low Ion Content
  • Low Thermal Expansion
  • Low Volatility
Compatible Substrates and Surfaces
  • Aluminum
  • Copper
  • Metal

Technical data

Table 1 of 2

3 rows
CharacteristicValueUnitMethod
Density (As Mixed)2.6Gram /ccASTM D792
Mixing Ratio1:1By weight—
Viscosity (As Mixed At 25°)90.0Pa.sASTM D2196

Table 2 of 2

13 rows
CharacteristicValueUnitMethod
Adhesion (Al/Ai Lap Shear)min. 1800PsiASTM D1002
Coefficient Of Thermal Expansion (Greater Tha Tg)90.0ppm/°CIPC-TM-650
Coefficient Of Thermal Expansion (Less Than Tg)22.0ppm/°CIPC-TM-650
Cure Time (125°C)30.0MinDSC
Cure Time (85°C)120.0MinDSC
Dielectric Strengthmin. 500Volt/mil ACASTM D149
Heat Capacity (25°C)1.0J/g-KASTM D1269
Pot / Work Life (25°C)30.0MinViscosity double
Temperature Usage-80 to 200°CTGA
Glass Transmission85.0°CDMA
Thermal Conductivity1.5W/m-KASTM D5470
Volume Resistivitymin. 10E+12Ohm-cmASTM D257

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