Silductor 6201
- Chemical Family
- Silicones
Silductor 6201 is an electrically conductive silicone adhesive.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Electrical & Electronic Systems
- Adhesives & Sealants
- Semiconductor Manufacturing
- Aerospace & Aviation
- Optical Fiber & Telecom
Product Families
- Conductive Adhesives
Other characteristics
- Brand
- Silductor
- Cure Method
- Heat Cure
- Product Type
- Conductive Adhesive
- Application Area
Aerospace Applications, Electronic Components, Semiconductors, Telecommunications Applications; Aerospace Applications; Electronic Components; Semiconductors; Telecommunications Applications
- Color
- Silver
- Safety
- General hygiene regulations should be observed.
- Markets
- Automotive & Transportation
- Consumer Goods
- Electrical & Electronics
- Storage
Silductor 6201 has a shelf life of at least 6 months when stored below − 15 °C in the originally sealed container. The 'Best use before end' date of each batch appears on the product label. Storage beyond the date specified on the label does not necessarily mean that the product is no longer usable. In this case however, the properties required for the intended use must be checked for quality assurance reasons.
- Shelf LIfe
- 6 months at 15°C (ITM)
- Cure
- Heat Cure
- Technology
- Ready-to-Use Products
- Characteristic
Silductor 6201 is an electrically conductive silicone adhesive for electronic applications. After cure at elevated temperature, it forms a flexible, rubbery compound with strong bonding to various substrates. It is used for compliant grounding, conducting, EMI shielding in semiconductor and electronics devices for its excellent electrical and thermal conductivity. Silductor 6201 is both dispensable and printable.
- Typical Applications
Aerospace electronics; Automotive electronics; Semiconductor and Telecommunications; Conducting while dissipating heat; Grounding of power devices; EMI shielding; Thermally conductive bonding; Silductor 6201 has a shelf life of at least 6 months when stored at − 15°C or below in the originally sealed container.
- Processing Instruction
Important! Silductor 6201 is platinum cure system. Please keep applied surface clean and avoid using this material on any surface that contains sulfur, amine, phosphorous, organo-metals, acid, etc., because these contaminants could inhibit the cure of the material.; For the package in a container (not in a cartridge), to ensure homogeneity of the material, the components must be stirred thoroughly before they are removed or processed in order to uniformly disperse any fillers that might have settled during storage.; We recommend running preliminary tests to optimize conditions for the particular application. Comprehensive processing instructions can be obtained by contacting directly to United Adhesives, Inc.
- Special Features and Benefits
- Good electrical conductivity
- Strong bonding to many substrates
- High thermal conductivity
- High temperature stability
- Flexible and reworkable
- Low bleeding, low volatile
- Low ionic content
- Ready to Use Product Features
- Electrically Conductive
- Electromagnetic Shielding (EMI)
- Flexible
- Good Thermal Conductivity
- Good Thermal Stability
- High Temperature Curing
- Low Bleeding
- Low Ion Content
Technical data
Table 1 of 2
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density | 4.9 | Gram /cc | ASTM D792 |
| Thixtropic Index | 2.5 | — | ASTM D2196 |
| Viscosity (25°C) | 78.0 | Pa.s | ASTM D2196 |
| Weight Loss In Cure | max. 0.2% | Weight % | TGA |
Table 2 of 2
12 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Adhesion (A/Ai Lap Shear) | min. 150 | Psi | ASTM D1002 |
| Coefficient Of Thermal Expansion | max. 100 | ppm/°C | IPC-TM-650 |
| Cure Time (125°C) | 60.0 | Minute | DSC |
| Cure Time (150°C) | 30.0 | Minute | DSC |
| Elongation | 120.0 | % | ASTM D638 |
| Hardness | 75.0 | Shore A | ASTM D2240 |
| Pot / Work Life (25°C) | min. 72 | Hour | Viscosity double |
| Temperature Usage | -50 to 230 | °C | TGA |
| Tensile Strength | 3.0 | MPa | ASTM D638 |
| Glass Transmission | -120.0 | °C | DMA |
| Thermal Conductivity | min. 6.0 | W/m-K | ASTM D5470 |
| Volume Resistivity | max. 5x 10-4 | Ohm-cm | ASTM D257 |
