United Adhesives ET1608
United Adhesives ET1608 is a thermally conductive adhesive.
Product families
Applications
- Electrical & Electronic Systems
- Printed Circuit Boards (PCBs)
- Semiconductor Manufacturing
- Aerospace & Aviation
- Optical Fiber & Telecom
Product Families
- Conductive Adhesives
Other characteristics
- Cure Method
- Heat Cure
- Product Type
2K (2 component) Adhesive, Conductive Adhesive, Epoxy Adhesive; 2K (2 component) Adhesive; Conductive Adhesive; Epoxy Adhesive
- Application Area
Aerospace Applications, Electronic Components, Heat Sink, Semiconductors, Telecommunications Applications; Aerospace Applications; Electronic Components; Heat Sink; Semiconductors; Telecommunications Applications
- Compatible Substrates & Surfaces
Aluminum, Ceramic, Copper, Glass, Metal, Plastics
- Color
- Yellow
- Safety
- General hygiene regulations should be observed.
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Storage
ET 1608 has a shelf life of at least 6 months when stored below 25°C in the originally sealed container. The 'Best use before end' date of each batch appears on the product label. Storage beyond the date specified on the label does not necessarily mean that the product is no longer usable. In this case however, the properties required for the intended use must be checked for quality assurance reasons.
- Cure
- Heat Cure
- Technology
- Ready-to-Use Products
- Characteristic
ET 1608 is a thermally conductive epoxy adhesive for electronic applications. It is two components with 2:1 mixing ratio, and can be cured at room temperature or elevated temperature after mixing. It provides strong bonding to metals such as aluminum, copper, plastics, FR4 PCBs, ceramics, glass, etc, with excellent thermal conductivity. The cured material also has very low CTE that can provide better thermal cycle performances. ET 1608 is dispensable.
- Typical Applications
- Aerospace electronics
- Automotive electronics
- Semiconductor and Telecommunications
- Bonding while dissipating heat
- Bonding of power devices to heat sinks
- Thermally conductive structural bonding
- Thermally conductive vibration
- Processing Instruction
Important! Only components A and B with the same lot number may be processed together! For the package in a container (not in a cartridge), to ensure homogeneity of the material, the components must be stirred thoroughly before they are removed or processed in order to uniformly disperse any fillers that might have settled during storage. For long-term storage, it is recommended to store the material in –40°C freezer to prevent filler from settling.. We recommend running preliminary tests to optimize conditions for the particular application. Comprehensive processing instructions can be obtained by contacting directly to United Adhesives, Inc.
- Special Features and Benefits
- Room temperature curable
- High thermal conductivity
- High temperature stability
- Low CTE for stress compliance
- Low bleeding, low volatile
- Low ionic content
- Ready to Use Product Features
- Good Thermal Conductivity
- Good Thermal Stability
- High Temperature Curing
- Low Bleeding
- Low Ion Content
- Low Thermal Expansion
- Low Volatility
- Thermally Conductive
- Compatible Substrates and Surfaces
- Aluminum
- Ceramic
- Copper
- Glass
- Metal
- Plastics
Technical data
Table 1 of 2
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density (As Mixed) | 2.6 | Gram /cc | ASTM D792 |
| Mixing Ratio (A :B) | 2:1 | By weight | — |
| Viscosity (As Mixed At 25°) | 50 to 130 | Pa.s | ASTM D2196 |
Table 2 of 2
14 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Adhesion (Avai Lap Shear) | min. 900 | Psi | ASTM D1002 |
| Coefficient Of Thermal Expansion (Greater Tha Tg) | 120.0 | ppm/°C | IPC-TM-650 |
| Coefficient Of Thermal Expansion (Less Than Tg) | 28.0 | ppm/°C | IPC-TM-650 |
| Cure Time (125°C) | 10.0 | Min | DSC |
| Cure Time (25°C) | 3 - 5 | hr | DSC |
| Cure Time (80°C) | 30.0 | Min | DSC |
| Dielectric Strength | min. 400 | Volt/mil Ac | ASTM D149 |
| Heat Capacity (25°C) | 1.0 | J/g-K | ASTM D1269 |
| Pot / Work Life (25°C) | 30.0 | Min | Viscosity double |
| Temperature Usage | -80 to 200 | °C | TGA |
| Glass Transmission | 55 - 75 | °C | DMA |
| Thermal Conductivity | 1.7 | W/m-K | ASTM D5470 |
