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United Adhesives ET1608

United Adhesives ET1608 is a thermally conductive adhesive.

Product families

Applications

Automotive & Transportation — Automotive
  • Electrical & Electronic Systems
Electrical & Electronics — Parts & Components
  • Printed Circuit Boards (PCBs)
  • Semiconductor Manufacturing
Automotive & Transportation — Transportation
  • Aerospace & Aviation
Electrical & Electronics — Wire & Cable
  • Optical Fiber & Telecom

Product Families

Ready-to-Use Products — Adhesives & Sealants
  • Conductive Adhesives

Other characteristics

Cure Method
Heat Cure
Product Type

2K (2 component) Adhesive, Conductive Adhesive, Epoxy Adhesive; 2K (2 component) Adhesive; Conductive Adhesive; Epoxy Adhesive

Application Area

Aerospace Applications, Electronic Components, Heat Sink, Semiconductors, Telecommunications Applications; Aerospace Applications; Electronic Components; Heat Sink; Semiconductors; Telecommunications Applications

Compatible Substrates & Surfaces

Aluminum, Ceramic, Copper, Glass, Metal, Plastics

Color
Yellow
Safety
General hygiene regulations should be observed.
Markets
  • Automotive & Transportation
  • Electrical & Electronics
Storage

ET 1608 has a shelf life of at least 6 months when stored below 25°C in the originally sealed container. The 'Best use before end' date of each batch appears on the product label. Storage beyond the date specified on the label does not necessarily mean that the product is no longer usable. In this case however, the properties required for the intended use must be checked for quality assurance reasons.

Cure
Heat Cure
Technology
Ready-to-Use Products
Characteristic

ET 1608 is a thermally conductive epoxy adhesive for electronic applications. It is two components with 2:1 mixing ratio, and can be cured at room temperature or elevated temperature after mixing. It provides strong bonding to metals such as aluminum, copper, plastics, FR4 PCBs, ceramics, glass, etc, with excellent thermal conductivity. The cured material also has very low CTE that can provide better thermal cycle performances. ET 1608 is dispensable.

Typical Applications
  • Aerospace electronics
  • Automotive electronics
  • Semiconductor and Telecommunications
  • Bonding while dissipating heat
  • Bonding of power devices to heat sinks
  • Thermally conductive structural bonding
  • Thermally conductive vibration
Processing Instruction

Important! Only components A and B with the same lot number may be processed together! For the package in a container (not in a cartridge), to ensure homogeneity of the material, the components must be stirred thoroughly before they are removed or processed in order to uniformly disperse any fillers that might have settled during storage. For long-term storage, it is recommended to store the material in –40°C freezer to prevent filler from settling.. We recommend running preliminary tests to optimize conditions for the particular application. Comprehensive processing instructions can be obtained by contacting directly to United Adhesives, Inc.

Special Features and Benefits
  • Room temperature curable
  • High thermal conductivity
  • High temperature stability
  • Low CTE for stress compliance
  • Low bleeding, low volatile
  • Low ionic content
Ready to Use Product Features
  • Good Thermal Conductivity
  • Good Thermal Stability
  • High Temperature Curing
  • Low Bleeding
  • Low Ion Content
  • Low Thermal Expansion
  • Low Volatility
  • Thermally Conductive
Compatible Substrates and Surfaces
  • Aluminum
  • Ceramic
  • Copper
  • Glass
  • Metal
  • Plastics

Technical data

Table 1 of 2

3 rows
CharacteristicValueUnitMethod
Density (As Mixed)2.6Gram /ccASTM D792
Mixing Ratio (A :B)2:1By weight—
Viscosity (As Mixed At 25°)50 to 130Pa.sASTM D2196

Table 2 of 2

14 rows
CharacteristicValueUnitMethod
Adhesion (Avai Lap Shear)min. 900PsiASTM D1002
Coefficient Of Thermal Expansion (Greater Tha Tg)120.0ppm/°CIPC-TM-650
Coefficient Of Thermal Expansion (Less Than Tg)28.0ppm/°CIPC-TM-650
Cure Time (125°C)10.0MinDSC
Cure Time (25°C)3 - 5hrDSC
Cure Time (80°C)30.0MinDSC
Dielectric Strengthmin. 400Volt/mil AcASTM D149
Heat Capacity (25°C)1.0J/g-KASTM D1269
Pot / Work Life (25°C)30.0MinViscosity double
Temperature Usage-80 to 200°CTGA
Glass Transmission55 - 75°CDMA
Thermal Conductivity1.7W/m-KASTM D5470

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