United Adhesives ET1643

Product families

Other characteristics

Cure Method

Heat Cure

Product Type

2K (2 component) Adhesive, Conductive Adhesive, Epoxy Adhesive; 2K (2 component) Adhesive; Conductive Adhesive; Epoxy Adhesive

Application Area

Aerospace Applications, Electronic Components, Heat Sink, Semiconductors, Telecommunications Applications; Aerospace Applications; Electronic Components; Heat Sink; Semiconductors; Telecommunications Applications

Compatible Substrates & Surfaces

Aluminum, Ceramic, Copper, Glass, Metal, Plastics

Color

• Grey
• Yellow

Safety

General hygiene regulations should be observed.

Markets

• Automotive & Transportation
• Electrical & Electronics

Storage

ET 1643 has a shelf life of at least 6 months when stored between 5°C and 30 °C in the originally sealed container. The 'Best use before end' date of each batch appears on the product label. Storage beyond the date specified on the label does not necessarily mean that the product is no longer usable. In this case however, the properties required for the intended use must be checked for quality assurance reasons.

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Cure

Heat Cure

Technology

Ready-to-Use Products

Characteristic

ET1643 is an epoxy-based high thermally conductive structural bonding adhesive for electronic applications. It is a two-component, non-slump, addition-curing system that cures at room temperature or elevated temperature to provide strong bonding to metals such as aluminum, copper, and FR4 based printed circuit board with excellent thermal conductivity. The cured material also has very low CTE for better thermal cycle performances. ET1643 is both dispensable and printable.

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Typical Applications

• Aerospace electronics
• Automotive electronics
• Semiconductor and Telecommunications
• Between high heat power device and heat sink
• Thermally conductive structural bonding
• Thermally conductive vibration

Processing Instruction

Important! Only components A and B with the same lot number may be processed together! For the package in a container (not in a cartridge), to ensure homogeneity of the material, the components must be stirred thoroughly before they are removed or processed in order to uniformly disperse any fillers that might have settled during storage.. We recommend running preliminary tests to optimize conditions for the particular application. Comprehensive processing instructions can be obtained by contacting directly to United Adhesives Inc.

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Special Features and Benefits

• High thermal conductivity & ambient curable
• High temperature stability
• Low CTE for stress compliance
• Low bleeding, low volatile
• Low ionic content
• Pre-added 7 mil glass bead for thickness control

Ready to Use Product Features

• Good Thermal Conductivity
• Good Thermal Stability
• High Temperature Curing
• Low Bleeding
• Low Ion Content
• Low Thermal Expansion
• Low Volatility
• Non-slump
• 1 more

Compatible Substrates and Surfaces

• Aluminum
• Ceramic
• Copper
• Glass
• Metal
• Plastics