United Adhesives EP1641

Product families

Other characteristics

Cure Method

Heat Cure

Product Type

1K (1 component) Adhesive, Epoxy Adhesive, Potting Compound; 1K (1 component) Adhesive; Epoxy Adhesive; Potting Compound

Application Area

Aerospace Applications, Heat Sink, Semiconductor Die Attach, Semiconductors, Telecommunications Applications; Aerospace Applications; Heat Sink; Semiconductor Die Attach; Semiconductors; Telecommunications Applications

Compatible Substrates & Surfaces

Aluminum, Ceramic, Copper, Metal, Silicon, Stainless Steel

Color

• Blue
• Yellow

Safety

General hygiene regulations should be observed.

Markets

• Automotive & Transportation
• Electrical & Electronics

Storage

EP1641 has a shelf life of at least 6 months when stored at freezer (-40°C) in the originally sealed container. The 'Best use before end' date of each batch appears on the product label. Storage beyond the date specified on the label does not necessarily mean that the product is no longer usable. In this case however, the properties required for the intended use must be checked for quality assurance reasons.

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Cure

Heat Cure

Technology

Ready-to-Use Products

Characteristic

EP1641 is an epoxy-based low coefficient of thermal expansion (CTE) structural bonding and potting adhesive for electronic applications. It is a readily usable one-part that cures at elevated temperature to provide strong bonding to silicon, flip chip, BGA, ceramics, LTCC, aluminum, copper, stainless steel, etc. The very low CTE formulation provides better thermal cycle performances. Its strong oil and chemical resistance and high voltage insulation capability makes it ideal for electronic potting and encapsulation applications. EP1641 is flowable at both ambient and elevated cure temperature.

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Typical Applications

• Aerospace electronics
• Automotive electronics
• Semiconductor and Telecommunications
• Bonding of die to LTCC, Al, Cu
• Bonding of power devices to heat sinks
• Structural bonding or potting
• Resistance to thermal vibration
• Potting and encapsulation for media protection

Processing Instruction

The adhesive is a pre-mixed adhesive as one part for easier applying. In order to keep longer usage life, please always store the original or left material in freezer (- 40°C). For some applications, it is recommended to warm the adhesive to about 50°C to promote easier flow. Any possible air bubbles can be removed by vacuum.. We recommend running preliminary tests to optimize conditions for the particular application. Comprehensive processing instructions can be obtained by contacting directly to United Adhesives, Inc.

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Special Features and Benefits

• Low CTE for stress compliance
• High thermal stability
• High structural bonding strength
• Strong oil and chemical resistance
• Low bleeding, low volatile
• Low ionic content

Ready to Use Product Features

• Chemical Resistant
• Good Bonding Strength
• Good Flow
• Good Thermal Stability
• High Temperature Curing
• High Voltage Insulation
• Low Bleeding
• Low Ion Content
• 4 more

Compatible Substrates and Surfaces

• Aluminum
• Ceramic
• Copper
• Metal
• Silicon
• Stainless Steel