BondSeal BS8440
- Chemical Family
- Silicones
BondSeal BS8440 is a high bonding strength fast cure silicone adhesive.
Product families
Applications
- Electrical & Electronic Systems
- Housings & Enclosures
- Printed Circuit Boards (PCBs)
- Semiconductor Manufacturing
- Optical Fiber & Telecom
Product Families
- Conductive Adhesives
Other characteristics
- Brand
- BondSeal
- Cure Method
- Heat Cure
- Product Type
- 2K (2 component) Adhesive
- Application Area
Connectors, Electrical Components, Housing, Semiconductors, Telecommunications Applications; Connectors; Electrical Components; Housing; Semiconductors; Telecommunications Applications
- Application Method
- Injection
- Compatible Substrates & Surfaces
- Plastics
- Color
- Grey
- Safety
BondSeal BS8440 silicone contains neither toxic nor corrosive substances that might require special handling precautions. General hygiene regulations should be observed.
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Storage
BondSeal BS8440 has a shelf life of at least 6 months when stored between 4°C and 23 °C in the originally sealed container. Storage beyond the date specified does not necessarily mean that the product is no longer usable. In this case however, the properties required for the intended use must be checked for quality assurance reasons.
- Cure
- Heat Cure
- Technology
- Ready-to-Use Products
- Packaging Type
- Cartridges
- Characteristic
BondSeal BS8440 is a high bonding strength fast cure adhesive. It is a flowable, addition-curing, two-component silicone that cures at elevated temperature to a very tough rubber with excellent bonding strength to various plastics and substrates. It is non-corrosive and self-priming adhesion, and can be automated to dispense from needle or hand extruded from cartridge.
- Labeling Claims
- Non-Corrosive
- Application Methods
- Injection
- Typical Applications
Seal lids, covers, housings, connectors; Attach PCBs, base plates, components; Encapsulate parts, cavities; Automotive electronics; Semiconductor and Telecommunications; Vibration dampening; Thermal stress coupling; For the non-sag (thixotropic) version of this adhesive, please select the United Adhesives' product BondSeal BS8430.; For thermally conductive bonding adhesives, please select the United Adhesives' products Thermobond 3519 or 3821.
- Processing Instruction
Important! BondSeal BS8440 is platinum cure system. Please keep applied surface clean and avoid using this material on any surface that contains sulfur, amine, phosphorous, organo-metals, acid, etc. because these contaminants could inhibit the cure the material.; Only components A and B with the same lot number may be processed together.; We recommend running preliminary tests to optimize conditions for the particular application. Comprehensive processing instructions can be obtained by contacting directly to United Adhesives Inc.
- Special Features and Benefits
- Fast cure at 125C for 30 min
- Very strong bonding to various substrates
- Flowable
- Low bleeding, low volatile
- Low thermal stress
- Ready to Use Product Features
- Excellent Substrate Adhesion
- Fast Cure
- Good Bonding Strength
- Good Flow
- High Temperature Curing
- Low Bleeding
- Low Stress
- Low Volatility
- Compatible Substrates and Surfaces
- Plastics
Technical data
Table 1 of 2
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density (As Mixed) | 1.4 | Gram /cc | ASTM D792 |
| Mixing Ratio | 1:1 | By weight or by volume | No change in hardness |
| Viscosity (As Mixed At 25°) | 35 to 65 | Pa.s | ASTM D2196 |
Table 2 of 2
16 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Adhesion (Al/Ai Lap Shear, 250°C) | 600.0 | psi | ASTM D3163 |
| Cure Time (125°C) | 30.0 | Min | DSC |
| Cure Time (150°C) | 15.0 | Min | DSC |
| Cure Time (25°C) | 12.0 | Hr | DSC |
| Dielectric Constant (100 Hz) | 3.0 | — | ASTM D150 |
| Dielectric Strength | min. 450 | Volt/mil AC | ASTM D149 |
| Dissipation Factor (100 Hz) | max. 0.01 | — | ASTM D150 |
| Elongation | 240.0 | % | ASTM D638 |
| Hardness | 51.0 | Shore A | ASTM D2240 |
| Pot Life (25°C) | 2.0 | Hr | Viscosity double |
| Tensile Strength | 5.8 | Mpa | ASTM D638 |
| Glass Transmission | -120.0 | °C | TGA |
