United Adhesives EP1611
United Adhesives EP1611 is a flexible epoxy adhesive.
Product families
Applications
- Electrical & Electronic Systems
- Connectors
- Housings & Enclosures
- Printed Circuit Boards (PCBs)
- Semiconductor Manufacturing
- Aerospace & Aviation
- Optical Fiber & Telecom
Product Families
- Encapsulants
Other characteristics
- Cure Method
- Heat Cure
- Product Type
2K (2 component) Adhesive, Encapsulant, Epoxy Adhesive; 2K (2 component) Adhesive; Encapsulant; Epoxy Adhesive
- Application Area
Aerospace Applications, Connectors, Electronic Components, Housing, Semiconductors, Telecommunications Applications; Aerospace Applications; Connectors; Electronic Components; Housing; Semiconductors; Telecommunications Applications
- Compatible Substrates & Surfaces
- Ceramic, Metal, Plastics
- Color
- White
- Safety
- General hygiene regulations should be observed.
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Storage
EP1611 has a shelf life of at least 12 months when stored in ambient in the originally sealed container. The 'Best use before end' date of each batch appears on the product label. Storage beyond the date specified on the label does not necessarily mean that the product is no longer usable. In this case however, the properties required for the intended use must be checked for quality assurance reasons.
- Cure
- Heat Cure
- Technology
- Ready-to-Use Products
- Characteristic
Characteristics EP1611 is a flexible epoxy adhesive for sealing or encapsulating electronic devices. It is a twocomponent, non-slump, rubber-toughened formulation that cures at elevated temperature to provide strong bonding to various plastics, ceramics and metals. The flexibility reduces thermal stress and provides better thermal cycle performances. EP1611 is dispensable.
- Typical Applications
- Bonding / sealing of electronic components
- Encapsulate parts, cavities
- Bonding of plastics, ceramics and metals
- Attach PCBs, base plates, components
- Seal lids, covers, housings, connectors
- Vibration dampening
- Thermal stress coupling
- Aerospace & Automotive electronics
- Processing Instruction
Only components A and B with the same lot number may be processed together! For the package in a container (not in a cartridge), to ensure homogeneity of the material, the components must be stirred thoroughly before they are removed or processed in order to uniformly disperse any fillers that might have settled during storage. For potting applications, it is recommended to warm the parts to ~60°C, and then do potting. Any possible air bubbles in mixing or potting process can be removed by vacuum.. We recommend running preliminary tests to optimize conditions for the particular application. Comprehensive processing instructions can be obtained by contacting directly to United Adhesives, Inc.
- Special Features and Benefits
- Flexibility for stress reduction
- Fast cure and room temperature curable
- Flowable for potting / encapsulation
- Strong fracture toughness
- Strong bonding to various substrates
- Low bleeding, low volatile
- Ready to Use Product Features
- Excellent Substrate Adhesion
- Fast Cure
- Flexible
- Good Flow
- High Temperature Curing
- Low Bleeding
- Low Stress
- Low Volatility
- Compatible Substrates and Surfaces
- Ceramic
- Metal
- Plastics
Technical data
Table 1 of 2
3 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density (As Mixed) | 1.2 | Gram /cc | ASTM D792 |
| Mixing Ratio (A:B) | 1:1 | By volume | — |
| Viscosity (As Mixed At 25°) | 60000.0 | cps | ASTM D2196 |
Table 2 of 2
12 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Adhesion (Al/Ai Lap Shear) | min. 1500 | Psi | ASTM D1002 |
| Coefficient Of Thermal Expansion | 150.0 | ppm/°C | IPC-TM-650 |
| Cure Time (25°C) | 10 - 12 | hr | Durometer |
| Cure Time (85°C) | 60.0 | min | Durometer |
| Dielectric Constant (100 Hz) | 4.0 | — | ASTM D150 |
| Dielectric Strength | min. 400 | Volt/mil AC | ASTM D149 |
| Elongation | 50.0 | % | ASTM D638 |
| Hardness | 60.0 | Shore A | ASTM D2240 |
| Pot/Work Life (After Mixed Up, 25°C) | 0.5 | hr | Viscosity double |
| Temperature Usage | -80 to 150 | °C | TGA |
| Tensile Strength | 8.0 | Mpa | ASTM D638 |
| Volume Resistivity (24°C) | min. 10E+12 | Ohm-cm | ASTM D257 |
