United Adhesives OE1581
United Adhesives OE1581 is an optical transparent epoxy encapsulant.
Product families
Applications
- Electrical & Electronic Systems
- Displays
- Other Devices & Assemblies
- Medical Devices & Assemblies
- Semiconductor Manufacturing
- Optical Fiber & Telecom
Product Families
- Encapsulants
Other characteristics
- Cure Method
- Heat Cure
- Product Type
1K (1 component) Adhesive, 2K (2 component) Adhesive, Encapsulant, Epoxy Adhesive, Potting Compound; 1K (1 component) Adhesive; 2K (2 component) Adhesive; Encapsulant; Epoxy Adhesive; Potting Compound
- Application Area
LEDs, Lenses, Medical Devices, Semiconductors, Telecommunications Applications; LEDs; Lenses; Medical Devices; Semiconductors; Telecommunications Applications
- Compatible Substrates & Surfaces
- Ceramic, Metal, Silicon, Stainless Steel
- Color
- Transparent
- Safety
- General hygiene regulations should be observed.
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Healthcare & Pharma
- Storage
OE1581 has a shelf life of at least 6 months when stored at –40°C in the originally sealed container. The 'Best use before end' date of each batch appears on the product label. Storage beyond the date specified on the label does not necessarily mean that the product is no longer usable. In this case however, the properties required for the intended use must be checked for quality assurance reasons.
- Cure
- Heat Cure
- Technology
- Ready-to-Use Products
- Characteristic
OE1581 is one component water clear optically transparent epoxy adhesive / potting compound for L.E.D. encapsulating, fiber optics, clear potting, or any optical and electronic applications. After cured at elevated temperature, it forms a transparent, colorless solid with strong bonding to various substrates such as metals, silicon, flip chip, BGA, ceramics, LTCC, Al, Cu, stainless steel, etc. It is formulated with anti-ultraviolet protecting to minimize yellowing over time. It also provides bubble free and glass smooth finish.
- Typical Applications
- Opto-Electronic Applications
- LED Glob-Top Encapsulating
- Semiconductor and Telecommunications
- Optical Lens and IR Lens
- Fiber Optical Potting or Sealing
- Lens and Prism Bonding
- Bonding or Potting of Medical Devices
- Adhesive for Endoscopes or Light Guides
- Processing Instruction
Please let the compound thaw at room temperature before apply. Thawing time is typically 10 to 30 min depending on container size. Longer thawing time may need for larger size container. Any possible air bubbles in processing can be removed by applying vacuum.. We recommend running preliminary tests to optimize conditions for the particular application. Comprehensive processing instructions can be obtained by contacting directly to United Adhesives, Inc.
- Special Features and Benefits
- Water clear optical transparency
- One component and ready to use
- High bonding strength
- Low bleeding, low volatile
- Low ionic content
- Ready to Use Product Features
- Good Bonding Strength
- Good Non-Yellowing Properties
- Good Smoothness
- High Temperature Curing
- Low Bleeding
- Low Ion Content
- Low Volatility
- Compatible Substrates and Surfaces
- Ceramic
- Metal
- Silicon
- Stainless Steel
Technical data
Table 1 of 2
2 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Density | 1.05 | Gram /cc | ASTM D792 |
| Viscosity (As Mixed At 25°) | 3470.0 | cPs | ASTM D2196 |
Table 2 of 2
15 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Adhesion (Avai Lap Shear) | min. 800 | Psi | ASTM D1002 |
| Coefficient Of Thermal Expansion (Greater Tha Tg) | 120.0 | ppm/°C | IPC-TM-650 |
| Coefficient Of Thermal Expansion (Less Than Tg) | 60.0 | ppm/°C | IPC-TM-650 |
| Compress Strength | 150.0 | Mpa | ASTM D695 |
| Cure Time (125°C) | 30.0 | Min | DSC |
| Cure Time (85°C) | 2.0 | Hr | DSC |
| Dielectric Strength | min. 500 | Vol/mil AC | ASTM D149 |
| Flexible Strength | 120.0 | Mpa | ASTM D790 |
| Hardness | 70.0 | Shore D | DMA |
| Pot / Work Life (After Thawing, 25°C) | 8.0 | Hr | Viscosity double |
| Refractive Index (25°C) | 1.564 | — | ASTM D542 |
| Temperature Usage | -80 to 180 | °C | TGA |
