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DAP 224.0
- Chemical Family
- OrthophthalicsPhthalatesUnsaturated Polyester (UPE)
DAP 224 is a general-purpose diallyl ortho-phthalate molding compound filled with Dacroon. It is supplied in a flake form and can be easily molded using standard compression or transfer equipment. This type of compound is versatile and suitable for various molding applications.
Properties
- Physical Form
- Flakes
- Solid
Product families
Plastics — Thermoset Resins
- Other Thermoset Resins
Other characteristics
- Brand
- DAP
- Density
- 1600.0 - 1600.0 kg/m³
- Polymer Name
- Diallyl Phthalate
- Tensile Strength
- 24.804000000000002 - 34.45 MPa
- Processing Methods
- Compression Molding, Transfer Molding
- Flame Rating
- UL 94 HB
- Key Features
It has excellent electrical properties with an impact strength considerably higher than Orlon-filled material.. A special process enables 224 to retain its excellent volume and surface resistance after prolonged exposure to elevated temperatures and 100% humidity.
- Technology
- Plastics
- Fillers Included
- Dacron
- Material Features
- Easy To Mold
- Enhanced Physical Properties
- General Purpose
- Good Electrical Properties
- Good Impact Strength
- Low Odor
- Applications
The inherent strength of Dacron fibers makes this compound excellent for applications requiring high physical and/or electrical properties.
- Certifications and Compliance
- ISO 9001
- UL 94
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Compression Molding
- Transfer Molding
Technical data
Table 1 of 5
4 rows| Characteristic | Value | Unit |
|---|---|---|
| Flexural Strength | 10 - 12,000 | psi |
| Compressive Strength | 18 - 25,000 | psi |
| Tensile Strength | 3,600 - 5,000 | psi |
| Impact Strength (Izod Notched) | 3 | ft-lb / inch |
Table 2 of 5
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Dimensional Stability | max. 0.06 | % |
| Thermal Expansion (at -40 °C to 100 °C) | 4 | 10⁻⁵ / °C |
| Heat Distortion Temperature (at 18.6 kg/cm²) | 260 | °C |
Table 3 of 5
15 rows| Characteristic | Value | Unit |
|---|---|---|
| Arc Resistance | 125 | seconds |
| Dielectric Strength (Kv Step-by-Step, Dry) | 360 | volts/mil |
| Dielectric Strength (Kv Step-by-Step, Wet) | 350 | volts/mil |
| Dielectric Breakdown (Step-by-Step, Dry) | 62 | Kv |
| Dielectric Breakdown (Step-by-Step, Wet) | 58 | Kv |
| Dielectric Constant (at 1 KHz, Dry) | 3.4 | — |
| Dielectric Constant (at 1 KHz, Wet) | 3.5 | — |
| Dissipation Factor (at 1KHz, Dry) | 0.005 | — |
| Dissipation Factor (at 1KHz, Wet) | 0.006 | — |
| Surface Resistance Megaohms (As is) | min. 10¹⁰ | — |
| Surface Resistance, megaohms (at 70 °C, 30 Days, at 100% RH) | 10⁴ | — |
| Dielectric Constant (at 1 MHz, Dry) | 3.5 | — |
Table 4 of 5
1 row| Characteristic | Value | Unit |
|---|---|---|
| Water Absorption (at 50 °C,48 hours) | 0.35 | % |
Table 5 of 5
5 rows| Characteristic | Value | Unit |
|---|---|---|
| Specific Gravity | 1.6 | — |
| Bulk Factor | 6 | — |
| Molding Pressure | 500 - 8,000 | psi |
| Molding Temperature | 135 - 190 | °C |
| Mold Shrinkage | 0.007 - 0.009 | In / In |
