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Cosmic Epoxy E4940S

Cosmic Epoxy E4940S is a mineral-filled epoxy molding compound supplied in granular form. It offers excellent dimensional stability, improved thermal cycling properties, and exceptional moisture resistance. This product is specifically designed for high-volume encapsulation of resistor networks and fiber-optic connectors that demand high quality, reliability, and excellent moldability.

Properties

Physical Form
  • Granules
  • Solid

Product families

Plastics — Thermoset Resins
  • Epoxies

Other characteristics

Brand
Cosmic Epoxy
End Uses

Encapsulant, Optical Fiber Connector, Resistor Network

Polymer Name
Epoxy Resins & Compounds
Flexural Strength
103.35 - 103.35 MPa
Volume Resistivity
10000000000000.0 - 10000000000000.0 Ohm-m
Markets
Electrical & Electronics
Shelf LIfe
6 months
Flame Rating
UL 94 V0
Key Features

It has excellent dimensional stability, improved thermal cycling and exceptional moisture resistance.; Standard spiral flow range is 25-35" (EMMI) at 1500C and 1000 psi.; It has a hot plate gel time of 22-30 seconds at 1600C, and 18-26 seconds at 1820C

Technology
Plastics
Fillers Included
Mineral
Material Features
  • Consistent High Quality
  • Dimensional Stability
  • Excellent Moisture Resistance
  • Good Moldability
  • Good Thermal Stability
  • Low Odor
Applications

It is designed for use in high-volume encapsulation of resistor networks and fiber-optic connectors requiring high quality, reliability and good moldability.

Handling Conditions

It has a shelf life of 6 months when stored at 5°C.

Certifications and Compliance
  • ISO 9001
  • UL 94
Plastics and Elastomers End Uses
  • Encapsulant
  • Optical Fiber Connector
  • Resistor Network
Plastics and Elastomers Functions
Resin

Technical data

Table 1 of 5

6 rows
CharacteristicValueUnit
Flexural Strength15000psi
Flexural Modulus2.0 x 10⁶psi
Compressive Strength28000psi
Tensile Strength12000psi
Impact Strength (Izod Notched)0.5ft-lb / inch
Barcol Hardness65—

Table 2 of 5

5 rows
CharacteristicValueUnit
Heat Deflection Temperature260°C
Glass Transition Temperature (Tg)175°C
Coefficient of Linear Expansion (Alpha 1)20 x 10⁻⁶°C
Coefficient of Linear Expansion (Alpha 2)70 x 10⁻⁶°C
Thermal Conductivity16 x 10⁻⁴cal/sec/cm²/°C/cm

Table 3 of 5

9 rows
CharacteristicValueUnit
Arc Resistance180seconds
Volume Resistance1 x 10¹⁵Ohm - cm
Surface Resistance1 x 10¹⁵Ohm - cm
Dielectric Strength (Kv Step-by-Step, Wet)350volts/mil
Dielectric Breakdown (Step-by-Step, Wet)56Kv
Dielectric Constant (at 1 KHz, Wet)3.9—
Dissipation Factor (at 1KHz, Wet)0.012—
Dielectric Constant (at 1 MHz, Wet)4.3—
Dissipation Factor (at 1MHz, Wet)0.011—

Table 4 of 5

1 row
CharacteristicValueUnit
Water Absorption (at 50 °C,48 hours)0.25%

Table 5 of 5

5 rows
CharacteristicValueUnit
Specific Gravity1.85—
Bulk Factor2 - 5—
Molding Pressure500 - 8,000psi
Molding Temperature150 - 180°C
Mold Shrinkage0.002 - 0.004In / In

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