Cosmic Epoxy E4940S
- Chemical Family
- Epoxy & Epoxy Derivatives
Cosmic Epoxy E4940S is a mineral-filled epoxy molding compound supplied in granular form. It offers excellent dimensional stability, improved thermal cycling properties, and exceptional moisture resistance. This product is specifically designed for high-volume encapsulation of resistor networks and fiber-optic connectors that demand high quality, reliability, and excellent moldability.
Properties
- Physical Form
- Granules
- Solid
Product families
- Epoxies
Other characteristics
- Brand
- Cosmic Epoxy
- End Uses
Encapsulant, Optical Fiber Connector, Resistor Network
- Polymer Name
- Epoxy Resins & Compounds
- Flexural Strength
- 103.35 - 103.35 MPa
- Volume Resistivity
- 10000000000000.0 - 10000000000000.0 Ohm-m
- Markets
- Electrical & Electronics
- Shelf LIfe
- 6 months
- Flame Rating
- UL 94 V0
- Key Features
It has excellent dimensional stability, improved thermal cycling and exceptional moisture resistance.; Standard spiral flow range is 25-35" (EMMI) at 1500C and 1000 psi.; It has a hot plate gel time of 22-30 seconds at 1600C, and 18-26 seconds at 1820C
- Technology
- Plastics
- Fillers Included
- Mineral
- Material Features
- Consistent High Quality
- Dimensional Stability
- Excellent Moisture Resistance
- Good Moldability
- Good Thermal Stability
- Low Odor
- Applications
It is designed for use in high-volume encapsulation of resistor networks and fiber-optic connectors requiring high quality, reliability and good moldability.
- Handling Conditions
It has a shelf life of 6 months when stored at 5°C.
- Certifications and Compliance
- ISO 9001
- UL 94
- Plastics and Elastomers End Uses
- Encapsulant
- Optical Fiber Connector
- Resistor Network
- Plastics and Elastomers Functions
- Resin
Technical data
Table 1 of 5
6 rows| Characteristic | Value | Unit |
|---|---|---|
| Flexural Strength | 15000 | psi |
| Flexural Modulus | 2.0 x 10⁶ | psi |
| Compressive Strength | 28000 | psi |
| Tensile Strength | 12000 | psi |
| Impact Strength (Izod Notched) | 0.5 | ft-lb / inch |
| Barcol Hardness | 65 | — |
Table 2 of 5
5 rows| Characteristic | Value | Unit |
|---|---|---|
| Heat Deflection Temperature | 260 | °C |
| Glass Transition Temperature (Tg) | 175 | °C |
| Coefficient of Linear Expansion (Alpha 1) | 20 x 10⁻⁶ | °C |
| Coefficient of Linear Expansion (Alpha 2) | 70 x 10⁻⁶ | °C |
| Thermal Conductivity | 16 x 10⁻⁴ | cal/sec/cm²/°C/cm |
Table 3 of 5
9 rows| Characteristic | Value | Unit |
|---|---|---|
| Arc Resistance | 180 | seconds |
| Volume Resistance | 1 x 10¹⁵ | Ohm - cm |
| Surface Resistance | 1 x 10¹⁵ | Ohm - cm |
| Dielectric Strength (Kv Step-by-Step, Wet) | 350 | volts/mil |
| Dielectric Breakdown (Step-by-Step, Wet) | 56 | Kv |
| Dielectric Constant (at 1 KHz, Wet) | 3.9 | — |
| Dissipation Factor (at 1KHz, Wet) | 0.012 | — |
| Dielectric Constant (at 1 MHz, Wet) | 4.3 | — |
| Dissipation Factor (at 1MHz, Wet) | 0.011 | — |
Table 4 of 5
1 row| Characteristic | Value | Unit |
|---|---|---|
| Water Absorption (at 50 °C,48 hours) | 0.25 | % |
Table 5 of 5
5 rows| Characteristic | Value | Unit |
|---|---|---|
| Specific Gravity | 1.85 | — |
| Bulk Factor | 2 - 5 | — |
| Molding Pressure | 500 - 8,000 | psi |
| Molding Temperature | 150 - 180 | °C |
| Mold Shrinkage | 0.002 - 0.004 | In / In |
