Cosmic Epoxy E4920FC
- Chemical Family
- Epoxy & Epoxy Derivatives
Cosmic Epoxy E4920FC is a mineral-filled epoxy molding compound available either in granular form or preformed in a variety of sizes and weights. It offers excellent moisture resistance, thermal cycling stability, and outstanding moldability. Parts molded from this material also resist fungus growth and are designed for the encapsulation of passive devices such as capacitors, inductors, diodes, and rectifiers.
Properties
- Physical Form
- Granules
- Solid
Product families
Applications
- Potting Compounds
- Other Parts & Components
Product Families
- Epoxies
Other characteristics
- Brand
- Cosmic Epoxy
- End Uses
Capacitors, Diodes, Encapsulant, Inductor, Rectifier
- Polymer Name
- Epoxy Resins & Compounds
- Flexural Strength
- 127.465 MPa
- Volume Resistivity
- 55,000,000,000,000.0 Ohm-m
- Color
- Black
- Gold
- Green
- Red
- Markets
- Electrical & Electronics
- Shelf LIfe
- 6 months
- Flame Rating
- UL 94 V0
- Key Features
It has excellent moisture resistance, thermal cycling stability and outstanding moldability.; Parts molded from this material do not support fungus growth.; It is available in a wide flow range to suit custom molding requirements. E4920FC can be supplied in black, gold, green or red.
- Technology
- Plastics
- Fillers Included
- Mineral
- Material Features
- Excellent Moisture Resistance
- Fungus Resistant
- Good Moldability
- Good Thermal Stability
- Low Odor
- Applications
It is designed for encapsulation of passive devices such as capacitors, inductors, diodes and rectifiers
- Handling Conditions
It has a shelf life of six months when stored at 5°C.
- Certifications and Compliance
- ISO 9001
- UL 94
- Plastics and Elastomers End Uses
- Capacitors
- Diodes
- Encapsulant
- Inductor
- Rectifier
- Plastics and Elastomers Functions
- Resin
Technical data
Table 1 of 5
6 rows| Characteristic | Value | Unit |
|---|---|---|
| Flexural Strength | 18500 | psi |
| Flexural Modulus | 2.0 x 10⁶ | psi |
| Compressive Strength | 35000 | psi |
| Tensile Strength | 12000 | psi |
| Barcol Hardness | 65 | — |
| Impact Strength (Izod Notched) | 0.5 | ft-lb / inch |
Table 2 of 5
5 rows| Characteristic | Value | Unit |
|---|---|---|
| Heat Deflection Temperature | 260 | °C |
| Glass Transition Temperature (Tg) | 175 | °C |
| Coefficient of Linear Expansion (Alpha 1) | 19 x 10⁻⁶ | °C |
| Coefficient of Linear Expansion (Alpha 2) | 70 x 10⁻⁶ | °C |
| Thermal Conductivity | 20 x 10⁻⁴ | cal/sec/cm²/°C/cm |
Table 3 of 5
9 rows| Characteristic | Value | Unit |
|---|---|---|
| Arc Resistance | 180 | seconds |
| Volume Resistance | 5.5 x 10¹⁵ | Ohm - cm |
| Surface Resistance | 40 x 10¹⁵ | Ohm - cm |
| Dielectric Strength (Kv Step-by-Step, Wet) | 400 | volts/mil |
| Dielectric Breakdown (Step-by-Step, Wet) | 56 | Kv |
| Dielectric Constant (at 1 KHz, Wet) | 3.9 | — |
| Dissipation Factor (at 1KHz, Wet) | 0.012 | — |
| Dielectric Constant (at 1 MHz, Wet) | 4.3 | — |
| Dissipation Factor (at 1MHz, Wet) | 0.011 | — |
Table 4 of 5
1 row| Characteristic | Value | Unit |
|---|---|---|
| Water Absorption (at 50 °C,48 hours) | 0.25 | % |
Table 5 of 5
5 rows| Characteristic | Value | Unit |
|---|---|---|
| Specific Gravity | 1.85 | — |
| Bulk Factor | 2 - 5 | — |
| Molding Pressure | 300 - 1,000 | psi |
| Molding Temperature | 150 - 180 | °C |
| Mold Shrinkage | 0.002 - 0.004 | In / In |
