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Farboset® 9025

Farboset® 9025 is a nonanhydride epoxy powder coating that is specifically formulated for use as an encapsulant for electronic components. One of its key characteristics is its excellent resistance to cracking during thermal cycling, which makes it ideal for applications where electronic components are subjected to temperature variations. This epoxy powder coating is designed for coating various electronic components, including resistor networks, hybrid circuits, varistors, and ceramic capacitors.

Properties

Physical Form
  • Granules
  • Solid

Product families

Applications

Electrical & Electronics — Packaging & Assembly
  • Electronics Coatings

Product Families

Ready-to-Use Products — Adhesives & Sealants
  • Encapsulants
Ready-to-Use Products — Paints & Coatings
  • Powder Coatings

Other characteristics

Brand
Farboset
Product Type
  • Encapsulant, Powder Coating
  • Encapsulant
  • Powder Coating
Application Area
Resistors
Application Method
Beugler Wheel, Fluid Bed Coating
Markets
Electrical & Electronics
Shelf LIfe
4 - 6 months
Technology
Ready-to-Use Products
Application Methods
  • Beugler Wheel
  • Fluid Bed Coating
Applications

This compound is designed for coating resistor networks, hybrid circuits, varistors and ceramic capacitors. It is suitable for use on wheel and fluid bed equipment.

Certifications and Compliance
ISO 9001
Ready to Use Product Features
Thermal Cracking Resistance

Technical data

Table 1 of 4

6 rows
CharacteristicValueUnit
Glass Transition Temperature (Tg)105.0°C
Linear Thermal Expansion (Alpha 1)60x 10⁻⁶cm/cm/°C
Linear Thermal Expansion (Alpha 2)160x 10⁻⁶cm/cm/°C
Thermal Conductivity7 x 10⁻⁴cal/cm-sec-°C
Sag Resistance (at 155°C, 40°angle)120.0mm
Hot Plate Gel Time (at 150 °C)105.0seconds

Table 2 of 4

5 rows
CharacteristicValueUnitMethod
Dissipation Factor (1 KHz)0.01—ASTM 150
Dielectric Constant (1 KHz)3.8—ASTM 150
Dielectric Strength850.0volts/milASTM 149
Surface Resistivity1x 10¹⁶ohm-cm—
Volume Resistivity8.0x 10¹⁵Ohm - cm—

Table 3 of 4

6 rows
CharacteristicValueUnit
Particle Size (U.S. Mesh, +80 max)1.0%
Particle Size (U.S. Mesh, -325)30 - 40%
Cure Time (at 125°C)60.0minutes
Cure Time (at 150°C)18.0minutes
Cure Time (at 175°C)10.0minutes
Molded Density1.44gm/cc

Table 4 of 4

1 row
CharacteristicValueUnit
Water Absorption (at 23 °C, 24 hours)0.07%

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