To catalogue
Cosmic Epoxy E484-FDA
- Chemical Family
- Epoxy & Epoxy Derivatives
Cosmic Epoxy E484-FDA is a mineral-filled, glass-reinforced, electrical-grade epoxy molding compound supplied in granular form. It has received approval for direct food contact. Notably, it possesses outstanding mechanical strength and electrical properties, especially at high temperatures, and has met the rigorous NASA outgassing standards. This material is used in electrical hardware applications such as underwater connectors and other insulation needs.
Properties
- Physical Form
- Granules
- Solid
Product families
Applications
Electrical & Electronics — Parts & Components
- Connectors
Electrical & Electronics — Wire & Cable
- Jacketing & Insulation
Product Families
Plastics — Thermoset Resins
- Epoxies
Other characteristics
- Brand
- Cosmic Epoxy
- End Uses
- Connectors, Electrical Insulation
- Polymer Name
- Epoxy Resins & Compounds
- Flexural Strength
- 130.91 MPa
- Volume Resistivity
- 100,000,000.0 Ohm-m
- Markets
- Electrical & Electronics
- Key Features
It has excellent mechanical strength and electrical properties, especially at high temperatures. It has passed NASA out-gassing tests.
- Technology
- Plastics
- Fillers Included
- Glass/Mineral
- Material Features
- Excellent Mechanical Strength
- Good Electrical Properties
- Low Odor
- Applications
Used in electrical hardware applications such as underwater connectors and other insulation applications.
- Certifications and Compliance
- FDA Compliant
- ISO 9001
- Plastics and Elastomers End Uses
- Connectors
- Electrical Insulation
- Plastics and Elastomers Functions
- Resin
Technical data
Table 1 of 5
6 rows| Characteristic | Value | Unit |
|---|---|---|
| Flexural Strength | 19000 | psi |
| Flexural Modulus | 2.6 x 10⁶ | psi |
| Compressive Strength | 30000 | psi |
| Tensile Strength | 14000 | psi |
| Impact Strength (Izod Notched) | 0.6 | ft-lb / inch |
| Barcol Hardness | 65 - 75 | — |
Table 2 of 5
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Heat Deflection Temperature | 260 | °C |
| Glass Transition Temperature (Tg) | 165 | °C |
| Thermal Conductivity | 10 x 10⁻⁴ | cal/sec/cm²/°C/cm |
Table 3 of 5
9 rows| Characteristic | Value | Unit |
|---|---|---|
| Arc Resistance | 186 | seconds |
| Volume Resistance | min. 10¹⁰ | Ohm - cm |
| Surface Resistance | min. 1 x 10¹⁵ | Ohm - cm |
| Dielectric Strength (Kv Step-by-Step, Wet) | 350 | volts/mil |
| Dielectric Breakdown (Step-by-Step, Wet) | 60 | Kv |
| Dielectric Constant (at 1 KHz, Wet) | 5.4 | — |
| Dissipation Factor (at 1KHz, Wet) | 0.011 | — |
| Dielectric Constant (at 1 MHz, Wet) | 4.7 | — |
| Dissipation Factor (at 1MHz, Wet) | 0.008 | — |
Table 4 of 5
1 row| Characteristic | Value | Unit |
|---|---|---|
| Water Absorption (at 50 °C,48 hours) | 0.25 | % |
Table 5 of 5
5 rows| Characteristic | Value | Unit |
|---|---|---|
| Specific Gravity | 1.95 | — |
| Bulk Factor | 2.0 - 5.0 | — |
| Molding Pressure | 500 - 8,000 | psi |
| Molding Temperature | 150 - 180 | °C |
| Mold Shrinkage | 0.002 - 0.004 | In / In |
