Cosmic Epoxy EH51
- Chemical Family
- Epoxy & Epoxy Derivatives
Cosmic Epoxy EH51 is an iron-filled epoxy molding compound available in a black granular form. It is designed for EMI/RFI shielding applications and can be used in compression or transfer molding processes to create core rods or encapsulate surface mount and axial leaded inductors. This material simplifies the manufacturing process by allowing for single molded applications, eliminating the labor-intensive over/under molding.
Properties
- Physical Form
- Granules
- Solid
Product families
Applications
- Potting Compounds
Product Families
- Epoxies
Other characteristics
- Brand
- Cosmic Epoxy
- End Uses
- Core Rods, Encapsulant, Inductor
- Polymer Name
- Epoxy Resins & Compounds
- Processing Methods
- Compression Molding, Transfer Molding
- Color
- Black
- Markets
- Electrical & Electronics
- Shelf LIfe
- 6 months
- Key Features
This material flows easily under low pressure and provides good moldability.
- Technology
- Plastics
- Fillers Included
- Iron
- Material Features
- Electromagnetic Shielding (EMI)
- Good Flow
- Good Moldability
- Low Odor
- Radio Frequency Shielding (RFI)
- Applications
This material is good for EMI / RFI shielding, and can be either compression or transfer molded to fabricate core rods, or to encapsulate surface mount and axial leaded inductors. This single molded compound eliminates the labor intensive over/under molding.
- Certifications and Compliance
- ISO 9001
- Plastics and Elastomers End Uses
- Core Rods
- Encapsulant
- Inductor
- Plastics and Elastomers Functions
- Resin
- Plastics and Elastomers Processing Methods
- Compression Molding
- Transfer Molding
Technical data
Table 1 of 3
2 rows| Characteristic | Value | Unit |
|---|---|---|
| Inductance | 0.20 - 0.26 | Ls (μH) |
| Quality Factor | 3.8 - 4.8 | — |
Table 2 of 3
4 rows| Characteristic | Value | Unit |
|---|---|---|
| Frequency | 1 | MHz |
| Specimen | 1/16 | Rod, inches |
| Wire Size | 0.008 | inches |
| Number of Turns | 25 | — |
Table 3 of 3
7 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Specific Gravity | 2.9 | — | — |
| Bulk Factor | 2.5 | — | — |
| Molding Pressure | 50 - 800 | psi | — |
| Molding Temperature | 130 - 180 | °C | — |
| Molding Temperature | 266 - 350 | °F | — |
| Spiral Range | 30 - 45 | inches | EMMI |
| Recommended Post Cure (at 160 °C) | 2 - 4 | hours | — |
