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Ebalta Kunststoff Gmbh Silicone casting compound LM

Chemical Family
Silicones

Silicone casting compound LM is an addition curing silicone which cures at room temperature. After curing the material is food safe according to "BfR" and can be used as baking tin, molds for manufactoring chocolate, and so on. Any different handling of the silicone leads to expiration of license.

Product families

Applications

Applications
  • Consumer Goods — Housewares
Industrial — Chemical & Industrial Manufacturing
  • Tooling & Moldmaking

Product Families

Elastomers — Specialty Elastomers
  • Silicone Elastomers

Other characteristics

End Uses

Containers, Front Spoiler, Mold Making, Side Spoiler, Thermoformed Cups, Thermoformed Trays, Trays

Features
Low Viscosity
Polymer Name
Silicone Elastomer
Processing Methods
Casting
Basis
Silicone casting compound LM
Markets
  • Consumer Goods
  • Industrial
Storing

Storage at room temperature 18-25 °C. Opened containers should be closed immediately after use and should be used up as soon as possible. Shelf life: see labels

Technology
Elastomers
Material Features
Low Viscosity
Processing Instruction

Mix Comp. A and B according to mixing ratio.; The mixture cures at 23 °C for 4-6 hours.; In order to achieve food safety the molds have to be postcured at 200° for 4 hrs. to make the volatile contents escaping.; For bubble free molds evacuate the material for about 5-10 min. at 30-50 mbar.

Certifications and Compliance
BfR Recommendation
Plastics and Elastomers End Uses
  • Containers
  • Front Spoiler
  • Mold Making
  • Side Spoiler
  • Thermoformed Cups
  • Thermoformed Trays
  • Trays
Plastics and Elastomers Processing Methods
Casting

Technical data

Table 1 of 1

9 rows
CharacteristicValueUnitMethod
Viscosity (25°C)24000 ± 1000mPa.s—
Elongation at break / test piece type S3A260 ± 20%DIN 53 504
Density (20°C)1,08 ± 0,02g/cm3—
Shore hardness35 ± 2Shore ADIN ISO 7619-1
Pot Life (200g/20°C)30 - 35minutes—
Tear resistance17 ± 3%ASTM D 624 B
Curing Time (60°C)4-6minutes—
Tensile strength3.8 ± 0.5MPaISO 37
Curing time at RT4-60Time in h (Temperature in °C)—

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