EpoxySet Inc. STG-40
- Chemical Family
- Silicones
STG-40 is a non-reactive, Silicone, Thermally Conductive Grease with a high thermal conductivity and low thermal resistance with a soft, non-flowable consistency. This product is formulated with specialty binding agents to achieve lowest amount of bleed and evaporations. It is designed for applications where a silicone thermal interface material is required and where the device may later need to be easily removed from the heat sink. This compound is ideally suited for use in thin cross-sectional thicknesses down to ≤1 mil.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Chassis & Brake
- Electrical & Electronic Systems
- Adhesives & Sealants
Product Families
- Greases
Other characteristics
- Features
Good Thermal Conductivity, Low Flow, Low Vent Bleed, Non-Toxic, Soft, Thermally Conductive
- Product Type
- Conductive Grease
- Application Area
Amplifiers, Coils, Electrical Components, Power Modules, Rectifiers, Relays, Semiconductors, TV Sets; Amplifiers; Coils; Electrical Components; Power Modules; Rectifiers; Relays; Semiconductors; TV Sets
- Markets
- Automotive & Transportation
- Consumer Goods
- Electrical & Electronics
- Clean Up
Standard approved clean-up and disposal procedures should be followed in every situation. The use of disposable containers and utensils are recommended whenever possible to simplify and expedite clean-up. However, when disposable containers are impractical, STG-40 can be removed by cleaning solvents with such as Mineral Spirit (Paint Thinner), Heptane or Isopropyl Alcohol.
- Shelf LIfe
- 5 Years
- Technology
- Ready-to-Use Products
- Labeling Claims
- Non-Flammable
- Non-Reactive
- Typical Application
Standard silicone thermal grease. Direct Replacement of Dow Corning 340 and Wakefield 120.
- Benefits and Features
Good Thermal Performance-(0.80 W/m°k); Low Interface Thermal Resistance. -(0.05 T-In W); Thin Bond lines to ≤ mil; Low bleed and evaporation.; Non-Toxic.; Reworkable/Easy to Remove.; Easy to Apply by Dispensing or Screen Printing/Stencil.
- Certifications and Compliance
- ISO 9001
- Ready to Use Product Features
- Good Thermal Conductivity
- Low Flow
- Low Vent Bleed
- Non-Toxic
- Soft
- Thermally Conductive
Technical data
Table 1 of 1
11 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Viscosity | Thixotropic Paste | — | — |
| Specific Gravity (at 25°C) | 2.2 | — | — |
| Evaporation (at 200°C, 24 hrs) | 0.5 | %wt | — |
| Bleed (at 200°C, 24 Hrs) | 0.5 | %/Wt | — |
| Thermal Conductivity | 0.8 | W/m °K | ASTM D5470 |
| Thermal Resistance | 0.05 | °C-In/W | — |
| Dielectric Strength (0.05" gap) | 390 | Volts/mil | ASTM D150 |
| Dielectric Constant (at 25°C, 1000Hz) | 4.4 | — | ASTM D150 |
| Dissipation Factor (at 25°C, 1000 Hz.) | 0.0021 | — | ASTM D150 |
| Volume Resistivity | 2.8 x 10^14 | Ω-cm | ASTM D257 |
| Operating Temperature Range | -65 to 205 | °C | — |
