EPOXIBOND™ EB-430-1HT
- Chemical Family
- Epoxy & Epoxy Derivatives
EB-430-1HT is a highly versatile epoxy adhesive formulated for semiconductor industry. An easy to dispense liquid paste, it offers high heat transfer, low shrinkage and a coefficient of thermal expansion comparable to that of copper and aluminum. This adhesive is designed for protecting IC's in TAB, as well as glob-top encapsulant for COB placement. Other applications include fabricating heat sinks, bonding semiconductors and transistors to heat sinks and general-purpose bonding of electronic components.
Properties
- Physical Form
- Liquid
- Paste
Product families
Applications
- Potting Compounds
- Semiconductor Manufacturing
- Power Transmission & Distribution
Product Families
- Conductive Adhesives
- Encapsulants
Other characteristics
- Brand
- EPOXIBOND
- Product Type
- Encapsulant
- Application Area
Electrical Components, Integrated Circuits, Power Transformers, Semiconductors; Electrical Components; Integrated Circuits; Power Transformers; Semiconductors
- Color
- White
- Markets
- Electrical & Electronics
- Warning
Adequate ventilation of workplace and ovens is essential. These materials may cause injury to the skin following prolonged or repeated contact and dermatitis in susceptible individuals. In case of skin contact, wash thoroughly with soap and water. For eyes, flush immediately with plenty of water for at least 10 minutes and seek medical attention.
- Shelf LIfe
Shelf life is 12 months from date of manufacturing in unopened container if stored properly at or below -40°C.
- Technology
- Ready-to-Use Products
- Industrial Usage
Practices of good housekeeping, safety and cleanliness should be followed before, during and after use.
- Packaging And Availability
Packaged in 10ml, 30ml syringes, and 10oz cartridges
- Use instructions
1. Use dispensing equipment for best results. 2. For small applications, apply the product using a syringe or clean spatula. 3. Avoid air entrapment to obtain optimum cured properties. 4. Proceed with the bonding application and cure as recommended. 5. Typical cured properties were determined using recommended cure schedule. Some difference in properties may occur with the alternate or other cure schedules.
- Ready to Use Product Features
- Good Thermal Conductivity
- Highly Versatile
- Low Shrinkage
- Thermally Conductive
Technical data
Table 1 of 2
4 rows| Characteristic | Value | Unit |
|---|---|---|
| Mixed Viscocity (at 25°C) | 8000 - 12000 | cPs |
| Pot Life (at 25°C, 100g) | 2 - 3 | days |
| Recommended Cure (at 100°C) | 2 | hours |
| Alternate Cure (at 150°C) | 10 | minutes |
Table 2 of 2
14 rows| Characteristic | Value | Unit |
|---|---|---|
| Specific Gravity | 1.35 | — |
| Hardness | 81 | Shore D |
| Lap Shear Strength to Aluminum (at -25°C) | 2400 | psi |
| Water Absorption (24 hr at Room Temperature) | 0.01 | % |
| Thermal Conductivity | 1.1 | W/m °K |
| Glass Transition Temperature (Tg) | 125 | °C |
| Service Temperature Range | -55 to 250 | °C |
| Coefficient of Thermal Expansion (Below Tg) | 29 | 10^-6/°C |
| Flexural Strength | 12800 | psi |
| Flexural Modulus | 8x10^5 | psi |
| Dielectric Strength | 450 | Volts/mil |
| Dielectric Constant (at 1 kHz) | 4.1 | — |
