EpoxySet Inc. EC-1012M/EH-20M
- Chemical Family
- Epoxy & Epoxy Derivatives
EC-1012M/EH-20M is a pourable, self-extinguishing, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.
Product families
Applications
- Potting Compounds
- Printed Circuit Boards (PCBs)
- Power Transmission & Distribution
Product Families
- Encapsulants
Other characteristics
- Product Type
- Encapsulant, Potting Compound
- Encapsulant
- Potting Compound
- Application Area
Capacitor Bushings, Integrated Circuits, Power Transformers; Capacitor Bushings; Integrated Circuits; Power Transformers
- Color
- Black
- Markets
- Electrical & Electronics
- Warning
Although the system contains low volatility materials, care should be taken in handling. Adequate ventilation of work place and ovens is essential. These materials may cause injury to the skin following prolonged or repeated contact and dermatitis in susceptible individuals. In case of skin contact, wash thoroughly with soap and water. For eyes, flush immediately with plenty of water for at least 10 minutes and seek medical attention.
- Shelf LIfe
The shelf life of these materials is greater than one year when stored in unopened containers at an average temperature of 25°C.
- Technology
- Ready-to-Use Products
- Industrial Usage
These materials are intended for industrial use only, and the practices of good housekeeping, safety and cleanliness should be followed before, during and after use.
- Certifications and Compliance
- ISO 9001
- Ready to Use Product Features
- Electrically Insulating
- Good Mechanical Properties
- Good Thermal Conductivity
- Low Shrinkage
- Pourable
- Self-extinguishing Characteristics
- Thermal Shock Resistant
Technical data
Table 1 of 2
5 rows| Characteristic | Value | Unit |
|---|---|---|
| Mixed Viscocity | 3000 - 6000 | cPs |
| Pot Life (at 25°C, 500g) | 4 - 5 | hours |
| Recommended Cure (at 65°C) | 3 | hours |
| Recommended Cure (at 130°C) | 1 | hours |
| Alternate Cure (at 25°C) | 24 - 48 | hours |
Table 2 of 2
14 rows| Characteristic | Value | Unit |
|---|---|---|
| Specific Giravity | 1.7 | — |
| Hardness | 91 | Shore D |
| Linear Shrinkage | 0 | % |
| Water Absorption (24 hr at Room Temperature) | 0.1 | % |
| Thermal Conductivity | 0.9 | W/m °K |
| Service Temperature Range | 40 to 160 | °C |
| Glass Transition Temperature (Tg) | 85 | °C |
| Coefficient of Thermal Expansion (Below Tg) | 38 | 10^-6/°C |
| Flexural Strength | 14800 | psi |
| Flexural Modulus | 7x10^5 | psi |
| Dielectric Strength | 410 | Volts/mil |
| Dielectric Constant (at 1 kHz) | 5.5 | — |
