EPOXIBOND™ EB-177
- Chemical Family
- Epoxy & Epoxy Derivatives
EPOXIBOND™ EB-107LY is a two-part, low viscosity, clear epoxy adhesive and encapsulating material. EB-107LY is a low yellowing version of EB-107LP-2. It is recommended for bonding and encapsulating where reduced yellowing is preferred. It is recommended for joining transparent materials, such as glass, and where a thin bond line is desired. EB-107LY can be used for bonding most metals, ceramics, and some plastics.
Product families
Applications
- Medical Devices & Assemblies
- Potting Compounds
- Semiconductor Manufacturing
- Optical Fiber & Telecom
Product Families
- Encapsulants
Other characteristics
- Brand
- EPOXIBOND
- Cure Method
- Heat Cure
- Product Type
2K (2 component) Adhesive, Adhesive, Potting Compound; 2K (2 component) Adhesive; Adhesive; Potting Compound
- Application Area
Medical Applications, Medical Devices, Optical Applications, Optoelectronics Devices; Medical Applications; Medical Devices; Optical Applications; Optoelectronics Devices
- Markets
- Electrical & Electronics
- Healthcare & Pharma
- Shelf LIfe
- 1 Year
- Cure
- Heat Cure
- Technology
- Ready-to-Use Products
- Certification
- USP Class VI Certified for Biocompatibility
- Frozen Adhesive
Thaw premixed frozen adhesive at room temperature for 5-10 minutes. Dispense adhesive and cure at recommended schedules.
- Labeling Claims
- Biocompatible
- Non-Hazardous
- Non-Toxic
- Curing
- Recommended Cure
- 2 hr at 80°C + 2 hr at 125°C
- Alternate Cure
- 1 hr at 150°C
- HIGHLIGHTS
EB-177 is a low viscosity, high Tg, two part epoxy that can be used for potting, encapsulating, or bonding.; It is used highly in the medical, optical, and semiconductor industries.; EB-177 has excellent high temperature resistance at 300°C and excellent solvent, chemical, and moisture resistance including gamma rays, autoclave, and ETO.; It is an excellent choice for semiconductor applications including capillary underfill or flip chip die attach.
- Safety Information
- For Industrial Use Only
- Practices of good housekeeping, safety and cleanliness should be followed before, during and after use
- Warning
- Adequate ventilation of workplace and ovens is essential. Refer to Material Safety Data Sheet (MSDS) for additional health and safety information.
- Use Instructions
Mix 100 grams of Resin (PART-A) to 100 grams of Hardener (PART-B) and mix it well preferably using a mechanical mixer.; Vacuum degasses for five minutes to remove dissolved and entrapped air.; Proceed with the bonding, casting or potting application and cure as recommended.
- Shelf Life Storage
One year when stored in unopened containers at an average temperature of 25°C.
- Packaging And Availability
- 2 parts Kit
- Packaged in Pint, Quart, Gallon, and 5-Gal
- Premixed and frozen
- Packaged in 3cc, 5cc, 10cc and 30cc disposable syringes and ship in dry ice at -80°C
- Certifications and Compliance
- ISO 9001
- REACH (Europe)
- RoHS Compliant
- Ready to Use Product Features
- Biocompatible
- Excellent Solvent Resistance
- High Impact Performance
- High Impact Resistance
- High Temperature Resistance
- Low Viscosity
- Non-Toxic
Technical data
Table 1 of 3
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Spectral Transmission (at 600nm) | min. 99 | % |
| Spectral Transmission (at 1000-1500nm) | min. 95 | % |
| Refractive Index (at 25°C, 589nm) | 1.52 | — |
Table 2 of 3
16 rows| Characteristic | Value | Unit |
|---|---|---|
| Specific Gravity | 1.2 | — |
| Hardness | 92 | Shore D |
| Water Absorption (24 hours Submersion at 25°C) | 0.17 | % |
| Lap Shear Strength to Aluminium | 1500 | psi |
| Linear Shrinkage | 0.17 | % |
| Flexural Strength (Yield) | 13500 | psi |
| Flexural Modulus (Yield) | 3.2x10⁵ | psi |
| Service Temperature Range | -55 to 250 | °C |
| Glass Transition Temperature (Tg) | 110 | °C |
| Coefficient of Linear Thermal Expansion (Below Tg) | 59 | 10⁻⁶/°C |
| Coefficient of Linear Thermal Expansion (Above Tg) | min. 150 | 10⁻⁶/°C |
| Dielectric Strength | 450 | Volts/mil |
Table 3 of 3
6 rows| Characteristic | Value | Unit |
|---|---|---|
| Epoxibond | Part A | — |
| Hardener | Part B | — |
| Mix Ratio by Weight (Resin/Hardener) | 1:1 | — |
| Mix Ratio by Volume (Resin/Hardener) | 1:1 | — |
| Mixed Viscosity (at 25°C) | 200 - 300 | cps |
| Pot Life (at 25°C, 100 grams) | min. 12 | hours |
