EpoxySet Inc. STG-41
- Chemical Family
- Silicones
STG-41 is a non-reactive, Silicone, Thermally Conductive Grease with a high thermal conductivity and low thermal resistance with a soft, non-flowable consistency. This product is formulated with specialty binding agents to achieve lowest amount of bleed and evaporations. It is designed for applications where a silicone thermal interface material is required and where the device may later need to be easily removed from the heat sink. This compound is ideally suited for use in thin cross-sectional thicknesses down to ≤ 1 mil.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Chassis & Brake
- Electrical & Electronic Systems
- Adhesives & Sealants
Product Families
- Greases
Other characteristics
- Features
Good Thermal Conductivity, Low Flow, Low Vent Bleed, Non-Toxic, Soft, Thermally Conductive
- Product Type
- Conductive Grease
- Application Area
Amplifiers, Coils, Electrical Components, Power Modules, Rectifiers, Relays, Semiconductors, TV Sets; Amplifiers; Coils; Electrical Components; Power Modules; Rectifiers; Relays; Semiconductors; TV Sets
- Markets
- Automotive & Transportation
- Consumer Goods
- Electrical & Electronics
- Clean Up
Standard approved clean-up and disposal procedures should be followed in every situation. The use of disposable containers and utensils are recommended whenever possible to simplify and expedite clean-up. However, when disposable containers are impractical, STG-41 can be removed by cleaning solvents with such as Mineral Spirit (Paint Thinner), Heptane or Isopropyl Alcohol.
- Shelf LIfe
- 5 Years
- Technology
- Ready-to-Use Products
- Base Oil
- Silicone
- Labeling Claims
- Non-Flammable
- Non-Reactive
- Typical Application
STG-41 Heat Sink Compound is applied to the base and mounting studs of transistors, diodes and silicone controlled rectifiers. In these situations, a small amount of the thermal grease is applied using either the dispensing of screen printing/stencil methods STG-41 can be used as a high- voltage corona suppressant/non-flammable coating, in connections for fly back transformers located in TV sets and similar design applications. It is also used in mounting semiconductor devices; thermoelectric modules; power transistors and diodes; coupling entire heat generating assemblies to chassis; heat transfer medium on ballasts; thermal joints; thermocouple wells; mounting power resistors; and for any devices where efficient cooling is required in major industries including, electronic (computer, appliance, wireless, etc.), automotive and electrical.
- Benefits and Features
Good Thermal Performance- (2.0 HW/m°k); Low Interface Thermal Resistance - (0.05 C-In2/W); Thin Bond lines to ≤ 1 mil.; Low bleed and evaporation.; Non-Toxic.; Reworkable/Easy to Remove.; Easy to Apply by Dispensing or Screen Printing/Stencil
- Certifications and Compliance
- ISO 9001
- Ready to Use Product Features
- Good Thermal Conductivity
- Low Flow
- Low Vent Bleed
- Non-Toxic
- Soft
- Thermally Conductive
Technical data
Table 1 of 1
11 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Viscosity | Thixotropic Paste | — | — |
| Specific Gravity (at 25°C) | 2.5 | — | — |
| Evaporation (at 200°C, 24 hrs) | 0.5 | %wt | — |
| Bleed (at 200°C, 24 Hrs) | 0.4 | %/Wt | — |
| Thermal Conductivity | 2 | W/m °K | ASTM D5470 |
| Thermal Resistance | 0.05 | °C-In/W | — |
| Dielectric Strength (0.05" gap) | 390 | Volts/mil | ASTM D150 |
| Dielectric Constant (at 25°C, 1000Hz) | 4.4 | — | ASTM D150 |
| Dissipation Factor (at 25°C, 1000 Hz.) | 0.0021 | — | ASTM D150 |
| Volume Resistivity | 2.8 x 10^14 | Ω-cm | ASTM D257 |
| Operating Temperature Range | -50 to 200 | °C | — |
