EpoxySet Inc. TG-69
TG-69 compound grease-like NON-SILICONE, NON- FLOWABLE material heavily filled with heat-conductive metal oxides. These combinations provide high thermal conductivity, low bleed and high temperature stability. TG-69 has been engineered to solve the problems of contamination and migration associated with silicone-based products. Unique polysynthetic-based thermal grease used to insure quick, efficient heat transfer and dissipation for the full operational life of your hardware.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Electrical & Electronic Systems
- Adhesives & Sealants
Product Families
- Greases
Other characteristics
- Features
Good Thermal Conductivity, High Dielectric Strength, High Temperature Strength, Improved Heat Transfer Efficiency, Low Creep, Low Vent Bleed, Thermally Conductive
- Product Type
- Thermal Grease
- Application Area
Amplifiers, Coils, Rectifiers, Relays, Semiconductors, TV Sets; Amplifiers; Coils; Rectifiers; Relays; Semiconductors; TV Sets
- Color
- White
- Markets
- Automotive & Transportation
- Consumer Goods
- Electrical & Electronics
- Clean Up
Standard approved clean-up and disposal procedures should be followed in every situation. The use of disposable containers and utensils are recommended whenever possible to simplify and expedite clean-up. However, when disposable containers are impractical, TG-69 can be removed by cleaning solvents with such as Mineral Spirit (Paint Thinner), Heptane or Isopropyl Alcohol.
- Shelf LIfe
TG-69 has a shelf-life of 2 years at room temperature (25°C) in unopened containers. Slight settling of the filler may occur during long-term storage. In this case, re-disperse the filler by hand or with mechanical mixing. Refrigerate material at 0- 10°C to avoid any settling.
- Technology
- Ready-to-Use Products
- Labeling Claims
- Non-Flammable
- Silicon-free
- Typical Application
TG-69 Heat sink compound is applied to the base and mounting studs of transistors, diodes and silicone controlled rectifiers. In these situations, a small amount of thermal grease is using either dispensing or screen printing/stencil methods. It can be used as a high-voltage corona suppressant/ non-flammable coating, in connections for fly back transformers in TV sets and similar design applications. It also used in mounting semi-conductor devices; thermoelectric modules; power transistors and diodes; coupling entire heat generating assemblies to chassis; heat transfer medium on ballasts; thermal joints; thermocouple wells; mounting power resistors; and for any devices where efficient cooling is required in major industries including, electronic (computer, appliance, wireless, etc.), automotive and electrical.
- Benefits and Features
Low Interface Thermal Resistance.; High Thermal Conductivity. (3.5W/m. °K); High dielectric strength.; Exceptionally low bleed and evaporation.; Non-Silicone Advantages/No creep or Migration over wide; temperature range.; Reworkable/Easy to Remove.; Easy to Dispense.
- Certifications and Compliance
- ISO 9001
- Ready to Use Product Features
- Good Thermal Conductivity
- High Dielectric Strength
- High Temperature Strength
- Improved Heat Transfer Efficiency
- Low Creep
- Low Vent Bleed
- Thermally Conductive
Technical data
Table 1 of 2
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Viscosity | Thixotropic Paste | — | — |
| Specific Gravity (at 25°C) | 2.7 | — | — |
| Evaporation (at 200°C, 24 hrs) | 0.5 | %wt | — |
| Thermal Conductivity | 3.5 | W/m °K | ASTM D5470 |
| Thermal Resistance | 0.02 | °C-In/W | — |
Table 2 of 2
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Dielectric Strength (0.05" gap) | 410 | Volts/mil | — |
| Dielectric Constant (at 25°C, 1000Hz) | 4.6 | — | ASTM D150 |
| Dissipation Factor (at 25°C, 1000 Hz.) | 0.003 | — | ASTM D150 |
| Volume Resistivity | 2.1x10^5 | Ω-cm | ASTM D257 |
| Operating Temperature Range | -55 to 200 | °C | — |
