EpoxySet Inc. STG-51TC
- Chemical Family
- Silicones
STG-51TC Heat Sink Compound is silicone thermal grease material heavily filled with heat-conductive metal oxides. These combinations provide high thermal conductivity, low bleed and high temperature stability. STG-51TC specially developed to solve the problems of contamination and migration associated with silicone-based products. The compound is a unique synthetic-based thermal grease use to insure quick, efficient heat transfer and dissipation
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Chassis & Brake
- Electrical & Electronic Systems
- Adhesives & Sealants
Product Families
- Greases
Other characteristics
- Features
Filled, Good Thermal Conductivity, Good Thermal Stability, High Dielectric Strength, High Temperature Resistance, Low Vent Bleed, Non-Toxic, Thermally Conductive
- Product Type
- Conductive Grease
- Application Area
- Power Modules, Semiconductors
- Power Modules
- Semiconductors
- Markets
- Automotive & Transportation
- Consumer Goods
- Electrical & Electronics
- Clean Up
It is recommended that customer use disposable containers and utensils whenever possible to simplify clean up. However, when disposable containers are impractical, STG-51TC can be removed by cleaning equipments with such as Mineral spirit (Paint thinner), Hexane or Isopropyl alcohol. Observe appropriate precautions.
- Shelf LIfe
- 5 Years
- Technology
- Ready-to-Use Products
- Base Oil
- Silicone
- Labeling Claims
- Non-Flammable
- Major Applications
Heat sink compound is applied to the base and mounting studs of transistors, diodes and silicone controlled rectifiers. In these situations, a small amount of thermal grease using either dispensing or screen printing/stencil is best. It has also been used as a high- voltage corona suppressant, non-flammable coating in connections for fly back transformers in TV sets and similar applications. It also used in mounting semiconductor devises; mounting power transistors and diodes; coupling entire heat generating assemblies to chassis; heat transfer medium on ballast; thermal joints; thermocouple wells; mounting power resistors; for any device where efficient cooling is required; major industries served include electronic (computer, appliance, wireless, etc.), automotive, electrical.
- Benefits and Features
- High temperature resistance.
- Exceptionally low Interface Thermal Resistance.
- High Thermal Conductivity, High dielectric
- strength.
- Exceptionally low bleed and evaporation.
- Thin Bondlines of 1-2 mil
- Will not harden, dry out or melt.
- Will not contaminate solder bath.
- Certifications and Compliance
- ISO 9001
- Ready to Use Product Features
- Filled
- Good Thermal Conductivity
- Good Thermal Stability
- High Dielectric Strength
- High Temperature Resistance
- Low Vent Bleed
- Non-Toxic
- Thermally Conductive
Technical data
Table 1 of 3
4 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Viscosity | 70000 | cPs | — |
| Specific Gravity (at 25°C) | 2.2 | — | — |
| Thermal Conductivity | 3.2 | W/m °K | ASTM D5470 |
| Operating Temperature Range | -55 to 205 | °C | — |
Table 2 of 3
1 row| Characteristic | Value | Unit |
|---|---|---|
| Thermal Resistance | 0.014 | °C-In/W |
Table 3 of 3
5 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Dielectric Strength (0.05" gap) | 225 | Volts/mil | — |
| Dielectric Constant (at 25°C, 1 KHz) | 2.8 | — | ASTM D150 |
| Dissipation Factor (at 25°C, 1000 Hz.) | 0.0026 | — | ASTM D150 |
| Volume Resistivity | 1.8x 10^14 | Ω-cm | ASTM D257 |
| Volume Resistivity | 1.0x 10^10 | Ω-cm | — |
