EpoxySet Inc. EC-1106
- Chemical Family
- Epoxy & Epoxy Derivatives
EC-1106 is an electronic grade Optically Clear Epoxy, Encapsulating and Potting Compound. This heat curing system has very low viscosity and long work life.
Product families
Applications
- Equipment & Parts
- Displays
- Medical Devices & Assemblies
- Potting Compounds
- Aerospace & Aviation
- Marine
Product Families
- Encapsulants
Other characteristics
- Product Type
- Encapsulant, Potting Compound
- Encapsulant
- Potting Compound
- Application Area
Aerospace Applications, LEDs, Marine Applications, Medical Devices; Aerospace Applications; LEDs; Marine Applications; Medical Devices
- Color
- Transparent
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Healthcare & Pharma
- Industrial
- Warning
Adequate ventilation of work place and ovens is essential. These materials may cause injury to the skin following prolonged or repeated contact and dermatitis in susceptible individuals. In case of skin contact, wash thoroughly with soap and water. For eyes, flush immediately with plenty of water for at least 10 minutes and seek medical attention.
- Shelf LIfe
The shelf life of these materials is one year when stored in unopened containers at an average temperature of 25°C
- Technology
- Ready-to-Use Products
- Industrial Usage
Practices of good housekeeping, safety and cleanliness should be followed before, during and after use.
- Material Features
- Good Optical Properties
- Use instructions
Mix 100 grams Resin to 100 grams of Hardener and mix it well preferably using a mechanical mixer.; Vacuum degasses for five minutes to remove dissolved and entrapped air.; Proceed with the casting or potting application and cure as recommended.
- Ready to Use Product Features
- Low Viscosity
- Application and Use
EC-1106 is used predominantly to pot or encapsulate, optical devices, light emitting diodes (LED), and other light emitters or sensors that require maximum light transmissions. As well, it is often used to allow easy visual inspection of components in potted electronic assemblies. The cured epoxy improves reliability, operational range, and lengthens the life of electrical and electronic parts. Its primary applications are in the automobile; marine; aerospace and aviation; communication, instrumentation; medical equipment and devices; and industrial control equipment industries.. It provides very strong electrical insulation and protects against static discharges, shocks, vibrations, mechanical impacts, environmental humidity, salt water, and many harsh chemicals.
Technical data
Table 1 of 4
1 row| Characteristic | Value | Unit |
|---|---|---|
| Resin Viscocity (at 25°C) | 60000 - 8000 | cPs |
Table 2 of 4
1 row| Characteristic | Value | Unit |
|---|---|---|
| Hardner Viscocity (at 25°C) | 50 - 100 | cPs |
Table 3 of 4
4 rows| Characteristic | Value | Unit |
|---|---|---|
| Mixed Viscocity (at 25°C) | 500 - 1000 | cPs |
| Pot Life (at 25°C, 100g) | min. 8 | hours |
| Recommended Cure (at 150°C) | 1 - 2 | hours |
| Alternate Cure (at 125°C) | 2 | hours |
Table 4 of 4
12 rows| Characteristic | Value | Unit |
|---|---|---|
| Specific Gravity | 1.2 | — |
| Hardness | 93 | Shore D |
| Water Absorption (24 hr at Room Temperature) | max. 0.1 | % |
| Glass Transition Temperature (Tg) | 126 | °C |
| Coefficient of Thermal Expansion (-55°C to 25°C) | 54 | 10^-6/°C |
| Coefficient of Thermal Expansion (25°C to 95°C) | 66 | 10^-6/°C |
| Lap Shear Strength | 2500 | psi |
| Flexural Strength | 18600 | psi |
| Flexural Modulus | 1x10^6 | psi |
| Dielectric Constant (at 1 kHz, 25°C) | 3 | — |
| Dissipation Factor (at 1 kHz, 25°C) | 0.003 | — |
| Volume Resistivity (at 25°C) | 2x10^16 | Ω-cm |
