SILCAST™ SC-550-LV-TC-1
- Chemical Family
- Silicones
SC-550-LV-TC-1 is a 100% silicone solid elastomer designed for electronic potting applications. This two-component system offers a hard, self-bonding, thermally conductive, low modulus material that is readily repairable. SC-550LV-TC-1 is highly filled and offers excellent thermal conductivity. It is also offers a convenient mix ratio of 1:1 by weight and volume.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Consumer Electronics
- Other Devices & Assemblies
- Adhesives & Sealants
- Potting Compounds
- Printed Circuit Boards (PCBs)
- Switches & Relays
- Power & Utilities
- Jacketing & Insulation
- Power Transmission & Distribution
Product Families
- Encapsulants
Other characteristics
- Brand
- SILCAST
- Product Type
2K (2 component) Adhesive, Encapsulant, Potting Compound; 2K (2 component) Adhesive; Encapsulant; Potting Compound
- Application Area
Amplifiers, Coils, Power Modules, Power Transformers, Rectifiers, Relays, TV Sets; Amplifiers; Coils; Power Modules; Power Transformers; Rectifiers; Relays; TV Sets
- Compatible Substrates & Surfaces
- Metal, Plastics
- Color
- Grey
- Markets
- Consumer Goods
- Electrical & Electronics
- Industrial
- Warning
Adequate ventilation of work place and ovens is essential. These materials may cause injury to the skin following prolonged or repeated contact and dermatitis in susceptible individuals. In case of skin contact, wash thoroughly with soap and water. For eyes, flush immediately with plenty of water for at least 10 minutes and seek medical attention.
- Advantages
Self-Bonding, excellent Adhesion to many plastics and metals; Easy to use 1:1 mix ratio by weight or volume; Long pot life at Room Temperature; Excellent Thermal cycling stability
- Shelf LIfe
- 1 Year
- Technology
- Ready-to-Use Products
- Packaging Type
- Totes (IBC)
- Industrial Usage
Practices of good housekeeping, safety and cleanliness should be followed before, during and after use.
- Packaging And Availability
Packaged in 1-gallon, 5-Gallon and 55-Gallon size
- Use instructions
1. Stir well the contents of each container every time before removing material. 2. Weigh each 100 grams of PART-A to 100 grams of Hardener PART-C. 3. Mix until uniform. Scrape the sides and bottom of container repeatedly during mixing. 4. Apply to clean bonding surfaces and cure as recommended to achieve the desired properties. 5. Typical cured properties were determined using recommended cure schedule. Some difference in properties may occur with the alternate or other cure schedules.
- Typical Application
- Potting and encapsulating of:
- Equipment modules
- Power supplies, relays and amplifiers
- Transformers, coils and ferrite cores
- Fiber optic wave guide coatings
- Encapsulation of circuit boards
- Certifications and Compliance
- ISO 9001
- Ready to Use Product Features
- Filled
- Good Adhesion
- Good Thermal Stability
- High Hardness
- Long Potlife
- Low Modulus
- Thermally Conductive
- Compatible Substrates and Surfaces
- Metal
- Plastics
Technical data
Table 1 of 2
6 rows| Characteristic | Value | Unit |
|---|---|---|
| Mix Ratio by Weight (PART A/PART C) | 100/100 | — |
| Mixed Viscocity (at 25°C) | 3000 - 4000 | cPs |
| Pot Life (500 grams at 25°C) | 1 - 2 | hours |
| Cure Option (at 70°C) | 2 | hours |
| Cure Option (at 100°C) | 20 | minutes |
| Cure Option (at 25°C) | 24 | hours |
Table 2 of 2
10 rows| Characteristic | Value | Unit |
|---|---|---|
| Specific Gravity | 1.8 | — |
| Hardness | 60 | Shore A |
| Tensile Strength | min. 300 | psi |
| Elongation | 80 | % |
| Thermal Conductivity | 1.2 | W/m °K |
| Service Temperature Range | -55 to 205 | °C |
| Dielectric Strength | 17.5 | kV/mm |
| Dielectric Constant (at 1 kHz) | 6 | — |
| Dissipation Factor (at 1 kHz) | max. 1.0 | — |
| Volume Resistivity | min. 1.0x10^4 | Ω-cm |
