EPOXICAST™ 1106F-LD
- Chemical Family
- Epoxy & Epoxy Derivatives
EC-1106F-LD is a low viscosity, easily pourable, epoxy syntactic foam. It features low density, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where added weight is undesired but resistance to mechanical and thermal shock are prime considerations. Typical Applications includes potting or encapsulating densely packaged power supplies, integrated circuits, small transformers, capacitors bushings etc.
Product families
- Printed Circuit Boards (PCBs)
- Power Transmission & Distribution
Other characteristics
- Brand
- EPOXICAST
- Density
- 749.136 - 749.136 kg/m³
- End Uses
Capacitor Bushings, Integrated Circuits, Power Transformers; Capacitor Bushings; Integrated Circuits; Power Transformers
- Foam Type
- Syntactic Foam
- Color
- Black
- Markets
- Electrical & Electronics
- Warning
Adequate ventilation of work place and ovens is essential. These materials may cause injury to the skin following prolonged or repeated contact and dermatitis in susceptible individuals. In case of skin contact, wash thoroughly with soap and water. For eyes, flush immediately with plenty of water for at least 10 minutes and seek medical attention.
- Product Type
- Foam
- Technology
- Ready-to-Use Products
- Industrial Usage
Practices of good housekeeping, safety and cleanliness should be followed before, during and after use.
- Product Families
- Ready-to-Use Products — Foams
- Packaging And Availability
2 parts Kit - Packaged in Gallon, and 5-Gallon size.
- Use instructions
Stir well the contents of each container every time before removing material. If the contents are hard or lumpy, warm to 80°C and mix thoroughly before removing material.. 1. Weigh each 100 grams of PART-A to 18 grams of Hardener PART-B 2. Mix until uniform. Scrape the sides and bottom of container repeatedly during mixing. 3. Proceed with potting application. Vacuums degas and cure as recommended to achieve the desired properties. 4. Typical cured properties were determined using recommended cure schedule. Some difference in properties may occur with the alternate or other cure schedules.
- Ready to Use Product Features
- Electrically Insulating
- Flexible
- Good Mechanical Properties
- Good Thermal Conductivity
- Low Density
- Low Shrinkage
- Low Viscosity
- Pourable
Technical data
Table 1 of 2
5 rows| Characteristic | Value | Unit |
|---|---|---|
| Compound Viscosity (at 25°C) | 10,000 - 20,000 | cPs |
| Mixed Viscocity (at 25°C) | 4000 - 8000 | cPs |
| Pot Life (at 25°C, 100g) | 2 | hours |
| Recommended Cure (at 100°C) | 1 - 2 | hours |
| Alternate Cure (at 25°C) | 24 - 48 | hours |
Table 2 of 2
11 rows| Characteristic | Value | Unit |
|---|---|---|
| Specific Gravity | 0.75 | — |
| Hardness | 85 | Shore D |
| Linear Shrinkage | 0.31 | % |
| Water Absorption (24 hr at Room Temperature) | 0.2 | % |
| Thermal Conductivity | 0.2 | W/m °K |
| Glass Transition Temperature (Tg) | 28 | °C |
| Dielectric Strength | 480 | Volts/mil |
| Dielectric Constant (at 1 kHz) | 2.8 | — |
| Dielectric Constant (at 1 MHz) | 2.3 | — |
| Dissipation Factor (at 1 kHz) | 0.14 | — |
| Volume Resistivity | 1x10^14 | Ω-cm |
