EPOXICAST™ EC-1009
- Chemical Family
- Epoxy & Epoxy Derivatives
EC-1009 is a pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations.
Product families
Applications
- Potting Compounds
- Printed Circuit Boards (PCBs)
- Power Transmission & Distribution
Product Families
- Encapsulants
Other characteristics
- Brand
- EPOXICAST
- Product Type
- Encapsulant, Potting Compound
- Encapsulant
- Potting Compound
- Application Area
Capacitor Bushings, Integrated Circuits, Power Transformers; Capacitor Bushings; Integrated Circuits; Power Transformers
- Color
- Black
- Markets
- Electrical & Electronics
- Warning
Adequate ventilation of workplace and ovens is essential. These materials may cause injury to the skin following prolonged or repeated contact and dermatitis in susceptible individuals. In case of skin contact, wash thoroughly with soap and water. For eyes, flush immediately with plenty of water for at least 10 minutes and seek medical attention.
- Technology
- Ready-to-Use Products
- Industrial Usage
Stir well the contents of each container every time before removing material. If the contents are hard or lumpy, warm to 80°C and mix thoroughly before removing material. 1. Weigh each 100 grams of EC-1009 to 10 grams of Hardener EH-21. 2. Mix until uniform. Scrape the sides and bottom of container repeatedly during mixing. 3. Apply to clean bonding surfaces and cure as recommended to achieve the desired properties. 4. Typical cured properties were determined using recommended cure schedule. Some difference in properties may occur with the alternate or other cure schedules.. Practices of good housekeeping, safety and cleanliness should be followed before, during and after use.
- Packaging And Availability
2 parts Kit - Packaged in Pint, Quart, Gallon, and 5-Gallon size.
- Ready to Use Product Features
- Electrically Insulating
- Good Mechanical Properties
- Good Thermal Conductivity
- Low Shrinkage
- Pourable
- Thermal Shock Resistant
- Thermally Conductive
Technical data
Table 1 of 2
5 rows| Characteristic | Value | Unit |
|---|---|---|
| Mix Ratio by Weight (Epoxicast/Hardener) | 100/10 | — |
| Mixed Viscocity (at 25°C) | 3000 - 5000 | cPs |
| Pot Life (at 25°C, 100g) | 3 | hours |
| Recommended Cure (at 65°C) | 3 | hours |
| Alternate Cure (at 25°C) | 24 - 48 | hours |
Table 2 of 2
25 rows| Characteristic | Value | Unit |
|---|---|---|
| Specific Gravity (24 Hrs at room temp) | 1.9 | — |
| Hardness (24 Hrs at room temp) | 86 | Shore D |
| Linear Shrinkage (24 Hrs at room temp) | 0.017 | % |
| Weight Loss (10 days exposure at 125°C) | 0.22 | % |
| Thermal Conductivity (24 Hrs at room temp) | 1.5 | W/m °K |
| Glass Transition Temperature (24 Hrs at room temp) | 56 | °C |
| Coefficient of Linear Thermal Expansion (at 10°C, Below Tg, 24 Hrs at room temp) | 31 | — |
| Flexural Strength (24 Hrs at room temp) | 16250 | psi |
| Flexural Modulus (24 Hrs at room temp) | 12x10^5 | psi |
| Dielectric Constant (at 1 kHz, 24 Hrs at room temp) | 6.1 | — |
| Dissipation Factor (at 1 kHz, 24 Hrs at room temp) | 0.015 | — |
| Volume Resistivity (24 Hrs at room temp) | 2x10^5 | Ω-cm |
