EPOXICAST™ EC-1015
- Chemical Family
- Epoxy & Epoxy Derivatives
EC-1015 is a low viscosity pourable filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating densely packaged electrical applications.
Product families
Applications
- Potting Compounds
- Printed Circuit Boards (PCBs)
- Semiconductor Manufacturing
- Power Transmission & Distribution
Product Families
- Encapsulants
Other characteristics
- Brand
- EPOXICAST
- Product Type
- Encapsulant, Potting Compound
- Encapsulant
- Potting Compound
- Application Area
Amplifiers, Integrated Circuits, Oscillators, Power Transformers, Semiconductors; Amplifiers; Integrated Circuits; Oscillators; Power Transformers; Semiconductors
- Color
- Black
- Markets
- Electrical & Electronics
- Warning
Adequate ventilation of workplace and ovens is essential.
- Shelf LIfe
The shelf life of these materials is greater than one year when stored in unopened containers at an average temperature of 25°C.
- Technology
- Ready-to-Use Products
- Industrial Usage
Practices of good housekeeping, safety and cleanliness should be followed before, during and after use.
- Packaging And Availability
2 parts Kit - Packaged in Pint, Quart, Gallon, and 5- Gallon size.
- Use instructions
Stir well the contents of each container every time before removing material. If the contents are hard or lumpy, warm to 80°C and mix thoroughly before removing material.. 1. Weigh each 100 grams of EC-1015 to 25 grams of Hardener EH-10. 2. Mix until uniform. Scrape the sides and bottom of container repeatedly during mixing. 3. Apply to clean bonding surfaces and cure as recommended to achieve the desired properties. 4. Typical cured properties were determined using recommended cure schedule. Some difference in properties may occur with the alternate or other cure schedules.
- Applications
It offers the excellent heat transfer, high voltage insulation and dimensional stability over a wide temperature range.; As an encapsulant for power devices it distributes heat evenly throughout the casting, providing greater efficiency and longer working life.; Excellent performance in densely packaged power supplies, integrated circuits, thick film hybrid devices, D/A converters, oscillators, amplifiers, relays, transformers and semiconductors etc.
- Ready to Use Product Features
- Dimensional Stability
- Electrically Insulating
- Good Thermal Conductivity
- High Voltage Insulation
- Low Shrinkage
- Low Viscosity
- Pourable
- Thermally Conductive
Technical data
Table 1 of 2
7 rows| Characteristic | Value | Unit |
|---|---|---|
| Mix Ratio by Weight (R/H) | 100/25 | — |
| Resin Viscosity (at 32°C) | 40000 | cPs |
| Mixed Viscocity (at 25°C) | 3000 - 5000 | cPs |
| Pot Life (at 25°C, 500g) | min. 8 | hours |
| Recommended Cure (at 70°C) | 2 | hours |
| Recommended Cure (at 150°C) | 2 | hours |
| Alternate Cure (at 100°C) | 4 | hours |
Table 2 of 2
14 rows| Characteristic | Value | Unit |
|---|---|---|
| Specific Gravity | 1.95 | — |
| Hardness | 92 | Shore D |
| Linear Shrinkage | 0.3 | % |
| Water Absorption (24 hr at Room Temperature) | 0.04 | % |
| Thermal Conductivity | 1.2 | W/m °K |
| Service Temperature Range | 55 to 180 | °C |
| Glass Transition Temperature (Tg) | 145 | °C |
| Dielectric Strength | 450 | Volts/mil |
| Dielectric Constant (at 1 kHz, 25°C) | 4.73 | — |
| Dielectric Constant (at 1 kHz, 100°C) | 4.84 | — |
| Dissipation Factor (at 1 kHz, 25°C) | 0.01 | — |
| Dissipation Factor (at 1 kHz, 100°C) | 0.01 | — |
