EPOXIBOND™ 142HT-1
- Chemical Family
- Epoxy & Epoxy Derivatives
EB-142HT-1 is unfilled, low viscosity, high temperature resistant epoxy adhesive. It maintains high lap shear strength up to 210°C and has excellent thermal and chemical resistance. It can be used for bonding, coating, and sealing applications where a thin film with high insulating resistance is required, particularly at elevated temperatures. It is recommended for bonding metals, glass, and ceramic substrates.
Product families
Applications
- Medical Devices & Assemblies
- Semiconductor Manufacturing
- Optical Fiber & Telecom
Product Families
- Structural Adhesives
Other characteristics
- Brand
- EPOXIBOND
- Product Type
- Adhesive
- Application Area
Capacitor Bushings, Capacitors, Electronic Components, Fiber Optic Cables, Medical Devices, Semiconductors; Capacitor Bushings; Capacitors; Electronic Components; Fiber Optic Cables; Medical Devices; Semiconductors
- Compatible Substrates & Surfaces
- Ceramic, Glass, Metal
- Color
- Amber
- Transparent
- Markets
- Electrical & Electronics
- Healthcare & Pharma
- Warning
Adequate ventilation of work place and ovens is essential. These materials may cause injury to the skin following prolonged or repeated contact and dermatitis in susceptible individuals. In case of skin contact, wash thoroughly with soap and water. For eyes, flush immediately with plenty of water for at least 10 minutes and seek medical attention.
- Technology
- Ready-to-Use Products
- Industrial Usage
Practices of good house-keeping, safety and cleanliness should be followed before, during and after use.
- Packaging And Availability
2 parts Kit - Packaged in Pint, Quart, and 1-Gallon size Premixed and frozen - Packaged in 3cc, 5cc, 10cc and 30cc disposable syringes and ship in dry ice at -80°C.
- Use instructions
Frozen Adhesive: Thaw premixed frozen adhesive at room temperature for 5-10 minutes. Dispense adhesive and cure at recommended schedules.
- Applications
- Semiconductor
- Wafer to wafer bonding of CSP; fabrication of MEMs devices; flip chip underfill
- Hybrid
- Down-Hole petrochemical fiber optic, good hermetic seals in sensor devices, resisting high temperature packaging sensors
- Fiber optic
- Sealing fiber into ferrules, transmitting light in the optical pathway, Fiber component packaging; adhesive for active alignment of optics, environmental seal of opto-package, V-groove arrays
- Medical
- Potting fiber optic bundles into ferrules for light guides and endoscopes; Capable of resisting several sterilization techniques; Meets USP Class VI Biocompatibility Standards; adhesive for catheter devices
- Electronics Assembly
- Used as dielectric layer in the fabrication of capacitors; laminating PZT ferroelectrics; Impregnating windings in motors and inductor coils; Bonding ferrite cores and magnets; Structural adhesive for electronic components
- Certifications and Compliance
- USP Class VI
- Ready to Use Product Features
- Chemical Resistant
- Good Thermal Stability
- High Lap Shear Strength
- High Temperature Resistance
- Low Viscosity
- Thermally Insulating
- Compatible Substrates and Surfaces
- Ceramic
- Glass
- Metal
Technical data
Table 1 of 2
3 rows| Characteristic | Value | Unit |
|---|---|---|
| Mix Ratio (By Weight, Part A/Part B) | 100/40 | — |
| MIxed Viscocity (at 25°C) | 2800 - 3800 | cPs |
| Pot Life (at 25°C, 100g) | 25 - 35 | minutes |
Table 2 of 2
14 rows| Characteristic | Value | Unit |
|---|---|---|
| Specific Gravity | 1.1 | — |
| Hardness | 88 | Shore D |
| Water Absorption (7 days at 25°C) | 0.03 | % |
| Lap Shear Strength to Aluminum | 2200 | psi |
| Flexural Strength | 11000 | psi |
| Flexural Modulus | min. 400,000 | psi |
| Service Temperature Range | -55 to 210 | °C |
| Glass Transition Temperature (Tg) | 138 | °C |
| Coefficient of Thermal Expansion (Below Tg) | 43 | 10^-6/°C |
| Coefficient of Thermal Expansion (Above Tg) | 190 | 10^-6/°C |
| Dielectric Strength | 380 | Volts/mil |
| Dielectric Constant (at 1 kHz) | 3.8 | — |
