URACAST™ UC-2521
- Chemical Family
- Urethanes
UC-2521 is a filled, two-part urethane resin system, which combines good handling characteristics with excellent cured properties. Its low viscosity allows good flowability and air release. The cured elastomer has excellent water resistance and is exceptionally resistant to thermal shock.
Product families
Applications
- Potting Compounds
- Printed Circuit Boards (PCBs)
- Power Transmission & Distribution
Product Families
- Encapsulants
Other characteristics
- Brand
- URACAST
- Product Type
2K (2 component) Adhesive, Encapsulant, Potting Compound; 2K (2 component) Adhesive; Encapsulant; Potting Compound
- Application Area
Amplifiers, Coils, Printed Circuit Boards, Rectifiers, Relays, TV Sets; Amplifiers; Coils; Printed Circuit Boards; Rectifiers; Relays; TV Sets
- Markets
- Electrical & Electronics
- Warning
Although the system contains low volatility materials, care should be taken in handling. Adequate ventilation of workplace and ovens is essential. These materials may cause injury to the skin following prolonged or repeated contact and dermatitis in susceptible individuals. In case of skin contact, wash thoroughly with soap and water. For eyes, flush immediately with plenty of water for at least 10 minutes and seek medical attention.
- Shelf LIfe
- 6 Months
- Technology
- Ready-to-Use Products
- Industrial Usage
These materials are intended for industrial use only, and the practices of good housekeeping, safety and cleanliness should be followed before, during and after use.
- Product Features
A machinable, urethane electrical potting compound. UC-2521 offers premium resistance to corrosive and environmental hazards, while providing electrical insulation.
- Use instructions
1. PART-B contains fillers & should be stirred or agitated without introducing excessive air before use to ensure that all fillers are properly dispersed. To obtain the best cured properties; accurate proportioning and thorough mixing are essential. 2. Mix contents thoroughly each time before removing material. 3. To each 100 grams of Part B, add 25 grams of Part A and mix it well preferably using a mechanical mixer. 4. Vacuum degas for about five minutes to remove any dissolved or entrapped air. 5. Proceed with the casting or potting application and cure as recommended.
- Applications
It is useful for general purpose casting, potting or encapsulating intricate circuits, operational amplifiers, transformers, and other electric/electronic components.
- Certifications and Compliance
- ISO 9001
- Ready to Use Product Features
- Corrosion Resistant
- Ease of Handling
- Electrically Insulating
- Filled
- Good Flow
- Good Weather Stability
- Low Viscosity
- Thermal Shock Resistant
Technical data
Table 1 of 4
1 row| Characteristic | Value | Unit |
|---|---|---|
| Viscosity (at 25°C, PART-A) | 10,000-14,000 | cPs |
Table 2 of 4
5 rows| Characteristic | Value | Unit |
|---|---|---|
| Polyol | Part B | — |
| Isocyanate | PART A | — |
| Mix Ratio by Weight (A:B) | 25:100 | — |
| Mixed Viscocity | 2000 - 4000 | cPs |
| Pot Life (at 25°C, 100g) | 20-30 | minutes |
Table 3 of 4
1 row| Characteristic | Value | Unit |
|---|---|---|
| Viscosity (at 25°C, PART-B) | 100 - 200 | cPs |
Table 4 of 4
12 rows| Characteristic | Value | Unit |
|---|---|---|
| Specific Gravity | 1.4 | — |
| Hardness | 50 | Shore D |
| Water Absorption (24 hr at Room Temperature) | 0.15 | % |
| Weight Loss (at 120°C, 7 days) | 0.2 | % |
| Thermal Conductivity | 0.3 | W/m °K |
| Service Temperature Range | -55 to 130 | °C |
| Glass Transition Temperature (Tg) | max. 10 | °C |
| Coefficient of Thermal Expansion | 120 | ppm/°C |
| Dielectric Strength (0.125 inch) | 420 | Volts/mil |
| Dielectric Constant (at 1 kHz) | 4.2 | — |
| Dissipation Factor (at 1 kHz) | 0.02 | — |
| Volume Resistivity | 2x10^14 | Ω-cm |
