EPOXICAST™ EC-1006
- Chemical Family
- Epoxy & Epoxy Derivatives
EPOXICAST-1006/EH-24 is a low viscosity, easily pourable, filled epoxy resin system featuring high thermal conductivity, good electrical insulation, and low shrinkage during cure. It is useful for potting and encapsulating components and modules where removal of heat and resistance to mechanical and thermal shock are prime considerations. The cured system provides excellent resistance to moisture, most organic solvents and inorganic chemicals.
Product families
Applications
- Potting Compounds
- Printed Circuit Boards (PCBs)
- Power Transmission & Distribution
Product Families
- Encapsulants
Other characteristics
- Brand
- EPOXICAST
- Product Type
- Encapsulant, Potting Compound
- Encapsulant
- Potting Compound
- Application Area
Capacitor Bushings, Integrated Circuits, Power Transformers; Capacitor Bushings; Integrated Circuits; Power Transformers
- Color
- Black
- Markets
- Electrical & Electronics
- Warning
Adequate ventilation of workplace and ovens is essential. These materials may cause injury to the skin following prolonged or repeated contact and dermatitis in susceptible individuals. In case of skin contact, wash thoroughly with soap and water. For eyes, flush immediately with plenty of water for at least 10 minutes and seek medical attention.
- Technology
- Ready-to-Use Products
- Industrial Usage
Practices of good housekeeping, safety and cleanliness should be followed before, during and after use.
- Packaging And Availability
2 parts Kit - Packaged in Pint, Quart, Gallon, and 5- Gallon size.
- Use instructions
Stir well the contents of each container every time before removing material. If the contents are hard or lumpy, warm to 80°C and mix thoroughly before removing material.. 1. Weigh each 100 grams of EC-1006 to 12 grams of Hardener EH-24. 2. Mix until uniform. Scrape the sides and bottom of container repeatedly during mixing. 3. Apply to clean bonding surfaces and cure as recommended to achieve the desired properties. 4. Typical cured properties were determined using recommended cure schedule. Some difference in properties may occur with the alternate or other cure schedules.
- Applications
General purpose epoxy encapsulating material. Designed for potting small or large electronic components.
- Ready to Use Product Features
- Electrically Insulating
- Flexible
- Good Mechanical Properties
- Good Thermal Conductivity
- Low Shrinkage
- Low Viscosity
- Pourable
- Thermal Shock Resistant
Technical data
Table 1 of 2
7 rows| Characteristic | Value | Unit |
|---|---|---|
| Mix Ratio by Weight (Resin/Hardener) | 100/16 | — |
| EC-1006 Viscosity (at 25°C) | 14000 - 18000 | cPs |
| Mixed Viscocity (at 25°C) | 1400 - 1800 | cPs |
| Pot Life (at 25°C, 100g) | 2 | hours |
| Recommended Cure (at 25°C) | 2 | hours |
| Recommended Cure (at 100°C) | 1 | hours |
| Alternate Cure (at 25°C) | 24 - 48 | hours |
Table 2 of 2
19 rows| Characteristic | Value | Unit |
|---|---|---|
| Specific Gravity | 1.58 | — |
| Hardness | 89 | Shore D |
| Linear Shrinkage | 0.31 | % |
| Water Absorption (24 hr at Room Temperature) | 0.09 | % |
| Thermal Conductivity | 0.35 | W/m °K |
| Glass Transition Temperature (Tg) | 78 | °C |
| Dielectric Strength | 480 | Volts/mil |
| Dielectric Constant (at 1 kHz) | 2.8 | — |
| Dielectric Constant (at 1 kHz) | 4.8 | — |
| Dielectric Constant (at 1 MHz) | 2.3 | — |
| Volume Resistivity | 1x10^14 | Ω-cm |
| Volume Resistivity | 3x10^15 | Ω-cm |
