SILCAST™ SC-454M-6
- Chemical Family
- Silicones
SC-454M-6 is a thermally conductive, low viscosity, condensation cure, RTV silicone potting or encapsulating compound. It is readily pourable and can cure at room temperature. The cured resin has a very good flexibility with excellent electrical properties and high temperature resistance.
Product families
Applications
- Consumer Goods — Appliances & Electronics
- Consumer Electronics
- Displays
- Other Devices & Assemblies
- Adhesives & Sealants
- Potting Compounds
- Switches & Relays
- Power Transmission & Distribution
Product Families
- Encapsulants
Other characteristics
- Brand
- SILCAST
- Cure Method
- Air Dry, Moisture Cure
- Product Type
- Encapsulant, Potting Compound
- Encapsulant
- Potting Compound
- Application Area
Amplifiers, Coils, Electrical Components, LEDs, Rectifiers, Relays, TV Sets; Amplifiers; Coils; Electrical Components; LEDs; Rectifiers; Relays; TV Sets
- Markets
- Consumer Goods
- Electrical & Electronics
- Warning
Although the system contains low volatility materials, care should be taken in handling. Adequate ventilation of workplace and ovens is essential. These materials may cause injury to the skin following prolonged or repeated contact and dermatitis in susceptible individuals. In case of skin contact, wash thoroughly with soap and water. For eyes, flush immediately with plenty of water for at least 10 minutes and seek medical attention.
- Shelf LIfe
The shelf life of these materials is six months when stored in unopened containers at an average temperature of 25°C.
- Cure
- Air Dry
- Moisture Cure
- Technology
- Ready-to-Use Products
- Product Features
SC-454M-6 is designed for potting and encapsulation of electrical/electronics components that require the dissipation of heat and the high temperature properties and low stress of a silicone compound. The cured material may be knife-cut for replacement of components and new compound may be poured in place and cured to re-form tight seal. Thermally conductive silicone potting compound used to encapsulate power supplies and heat sinks for LED lighting.
- Use instructions
Some filler settlement may occur during shipping and storage. Mix well the contents every time before removing material.
- Certifications and Compliance
- ISO 9001
- Ready to Use Product Features
- Good Electrical Properties
- Good Flexibility
- High Temperature Resistance
- Low Residual Stress
- Low Viscosity
- Pourable
- Temperature Resistance
- Thermally Conductive
Technical data
Table 1 of 2
4 rows| Characteristic | Value | Unit |
|---|---|---|
| Mix Ratio by Weight (Silcast/Catalyst) | 100/3 to 5 | — |
| Mixed Viscocity (at 25°C) | 4000 - 6000 | cPs |
| Pot Life (500 grams at 25°C) | 30 - 60 | minutes |
| Recommended Cure (at 25°C) | 24 | hours |
Table 2 of 2
11 rows| Characteristic | Value | Unit |
|---|---|---|
| Specific Gravity | 2.2 | — |
| Hardness | 70 | Shore A |
| Thermal Conductivity | 1.4 | W/m °K |
| Tensile Strength | 650 | psi |
| Elongation | 70 - 80 | % |
| Service Temperature Range | -65 to 250 | °C |
| Coefficient of Linear Thermal Expansion (-55°C to 25°C) | 150 | 10^-6/°C |
| Dielectric Strength (3 mm thick) | 540 | Volts/mil |
| Dielectric Constant (at 1 kHz) | 5.8 | — |
| Dissipation Factor (at 1 kHz) | 0.01 | — |
| Volume Resistivity | 6x10^14 | Ω-cm |
