EPOXICAST™ EC-1850FT
- Chemical Family
- Epoxy & Epoxy Derivatives
EC-1850FT is a pourable filled epoxy resin system offering excellent heat transfer, high voltage insulation, low exotherm and minimum shrinkage. It is a lower viscosity version of EC-1850FT. It rapidly transfers heat, eliminates hot spot, and increases the operating efficiency of most encapsulated devices. Its low shrinkage minimizes risk of damage to fragile components.
Product families
Applications
- Potting Compounds
- Printed Circuit Boards (PCBs)
- Semiconductor Manufacturing
- Power Transmission & Distribution
Product Families
- Encapsulants
Other characteristics
- Brand
- EPOXICAST
- Product Type
- Encapsulant, Potting Compound
- Encapsulant
- Potting Compound
- Application Area
Amplifiers, Integrated Circuits, Oscillators, Power Transformers, Semiconductors; Amplifiers; Integrated Circuits; Oscillators; Power Transformers; Semiconductors
- Color
- Black
- Markets
- Electrical & Electronics
- Warning
Although the system contains low volatility materials, care should be taken in handling. Adequate ventilation of workplace and ovens is essential. These materials may cause injury to the skin following prolonged or repeated contact and dermatitis in susceptible individuals. In case of skin contact, wash thoroughly with soap and water. For eyes, flush immediately with plenty of water for at least 10 minutes and seek medical attention.
- Shelf LIfe
The shelf life of these materials is greater than one year when stored in unopened containers at an average temperature of 25°C.
- Technology
- Ready-to-Use Products
- Industrial Usage
These materials are intended for industrial use only, and the practices of good housekeeping, safety and cleanliness should be followed before, during and after use.
- Product Features
Thermally conductive potting material that can be used with several curing agents to offer a wide variety of properties. EC-1850FT-LV is a lower viscosity version of EC-1850FT.
- Product Properties
- EH-26 (HAZMAT UN2922 Special Box required)
- 2 hr/100°C+ 2 hr/150°C
- Use instructions
The individual components containing fillers should be stirred or agitated without introducing excessive air before use to ensure that all fillers are properly dispersed. To obtain the best cured properties; accurate proportioning and thorough mixing are essential.. Mix contents thoroughly each time before removing material. To each 100 grams of Epoxicast-1850FT, add appropriate amount of Hardener of your choice and mix it well preferably using a mechanical mixer. Vacuum degasses for about five minutes to remove any dissolved or entrapped air. Proceed with the bonding application and cure as recommended.
- Applications
It is useful for potting and encapsulating densely packaged power supplies and heat generating components, integrated circuits, power and operational amplifiers, transformers and many types of semiconductors.
- Ready to Use Product Features
- Dimensional Stability
- Electrically Insulating
- Good Thermal Conductivity
- High Voltage Insulation
- Low Shrinkage
- Low Viscosity
- Pourable
- Thermally Conductive
Technical data
Table 1 of 1
20 rows| Characteristic | Value | Unit | Method |
|---|---|---|---|
| Mix Ratio by Weight | 3.5 | phr | — |
| Mixed Viscocity (at 25°C) | 50,000 - 60,000 | cPs | — |
| Pot Life (at 25°C, 500g) | 40 - 60 | minutes | — |
| Recommended Cure (at 70°C) | 2 | hours | — |
| Alternate Cure (at 25°C) | 24 - 48 | hours | — |
| Operating Temperature | 40 to 130 | °C | — |
| Specific Gravity | 2.3 | — | — |
| Hardness | 90 | Shore D | — |
| Lap Shear Strength to Aluminum | 2400 | psi | — |
| Linear Shrinkage | 0.013 | % | — |
| Water Absorption (24 hr immersion at Room Temperature) | 0.03 | % | — |
| Thermal Conductivity | 1.53 | W/m °K | ASTM D5470 |
