EPOXICAST™ EC-1190
- Chemical Family
- Epoxy & Epoxy Derivatives
EC-1190 is an epoxy encapsulating system with a very low density for use in the aerospace and medical industries. EC-1190 is low viscosity and can cure at room temperature when used with catalyst EH-21. EC-1190 has excellent chemical resistance and a low coefficient of thermal expansion (CTE).
Product families
Applications
- Medical Devices & Assemblies
- Potting Compounds
- Aerospace & Aviation
Product Families
- Encapsulants
Other characteristics
- Brand
- EPOXICAST
- Cure Method
- Air Dry
- Product Type
- Encapsulant, Potting Compound
- Encapsulant
- Potting Compound
- Application Area
- Aerospace Applications, Medical Devices
- Aerospace Applications
- Medical Devices
- Color
- Grey
- Markets
- Automotive & Transportation
- Electrical & Electronics
- Healthcare & Pharma
- Warning
Although the system contains low volatility materials, care should be taken in handling. Adequate ventilation of workplace and ovens is essential. These materials may cause injury to the skin following prolonged or repeated contact and dermatitis in susceptible individuals. In case of skin contact, wash thoroughly with soap and water. For eyes, flush immediately with plenty of water for at least 10 minutes and seek medical attention.
- Shelf LIfe
The shelf life of these materials is greater than one year when stored in unopened containers at an average temperature of 25°C.
- Cure
- Air Dry
- Technology
- Ready-to-Use Products
- Industrial Usage
These materials are intended for industrial use only, and the practices of good housekeeping, safety and cleanliness should be followed before, during and after use.
- Use instructions
The individual components containing fillers should be stirred or agitated without introducing excessive air before use to ensure that all fillers are properly dispersed. To obtain the best cured properties; accurate proportioning and thorough mixing are essential.. Mix contents thoroughly each time before removing material. To each 100 grams of Epoxicast EC-1190, add appropriate amount of Hardener of your choice and mix it well preferably using a mechanical mixer. Vacuum degasses for about five minutes to remove any dissolved or entrapped air. Proceed with the bonding application and cure as recommended.
- Performance Properties
- Properties of EH-75 when combine with EC-1190.
- Ready to Use Product Features
- Chemical Resistant
- Low Density
- Low Thermal Expansion
- Low Viscosity
Technical data
Table 1 of 1
18 rows| Characteristic | Value | Unit |
|---|---|---|
| Mix Ratio by Weight | 19 | — |
| Mixed Viscocity (at 25°C) | 2000 - 3000 | cPs |
| Pot Life (at 25°C, 500g) | 1 - 2 | hours |
| Recommended Cure (at 65°C) | 3 | hours |
| Alternate Cure (at 25°C) | 24 - 48 | hours |
| Specific Gravity | 0.74 | — |
| Hardness | 86 | Shore D |
| Flexural Strength | 6500 | psi |
| Compressive Strength | 8000 | psi |
| Linear Shrinkage | 0.02 | % |
| Water Absorption (24 hr immersion at Room Temperature) | 0.4 | % |
| Glass Transition Temperature (Tg) | 60 | °C |
