FLASHBOND™ UV-5403S

Chemical Family: Epoxy & Epoxy Derivatives

UV-5403S is a filled, low shrinkage, light curing epoxy adhesive that offers low CTE and high bonds strength. UV-5403S cures to a high bond strength polymer with excellent adhesive to metals, ceramics, and glass. This epoxy was specifically designed as a glob top encapsulant for smart card applications and encapsulations of chip modules. UV-5403S is free of solvents, has high ionic purity, and is resistant to moisture and humidity. This epoxy cures quickly under LED and UVA light.

Product families

Applications

Consumer Goods — Appliances & Electronics

Electrical & Electronics — Packaging & Assembly

Adhesives & Sealants

Product Families

Ready-to-Use Products — Adhesives & Sealants

Other Adhesives & Sealants

Other characteristics

Brand: FLASHBOND
Cure Method: Radiation Cure
Product Type: Epoxy Adhesive, Radiation Curable Coating
Epoxy Adhesive
Radiation Curable Coating
Application Area: Chip Module
Compatible Substrates & Surfaces: Ceramic, Glass, Metal
Markets: Consumer Goods
Electrical & Electronics
Appearance: Off White
Shelf LIfe: 6 Months
Cure: Radiation Cure
Technology: Ready-to-Use Products
Labeling Claims: Halogen-free
Product Features: RoHS& REACH Compliant
Halogen Free (IEC 61249-2-21)
High Bond Strength
Fast UV/LED Cure
Packaging And Availability: Syringes
Bulk
Applications: Glop Top
Dam & Fill
General Encapsulant
Certifications and Compliance: RoHS Compliant
Ready to Use Product Features: Filled
Good Bonding Strength
High Purity
Humidity Resistant
Low Shrinkage
Low Thermal Expansion
Moisture Resistant
UV Curable
Compatible Substrates and Surfaces: Ceramic
Glass
Metal

Technical data

Table 1 of 3

2 rows

Characteristic	Value	Unit
Optimal Wavelength (LED, UVA)	365	nm
Optimal Intensity	100 - 300	mW/cm2

Table 2 of 3