EPOXIBOND™ EB-316TC-2
- Chemical Family
- Epoxy & Epoxy Derivatives
EB-316TC-2 is a two component, thermally conductive, electrically insulating epoxy designed for heat sinking electronics and semiconductors. It may be used as an adhesive, potting, or encapsulation material, for industries such as consumer, medical or optics.
Product families
Applications
- Printed Circuit Boards (PCBs)
- Semiconductor Manufacturing
Product Families
- Structural Adhesives
Other characteristics
- Brand
- EPOXIBOND
- Product Type
- Structural Adhesive
- Application Area
- Printed Circuit Boards, Semiconductors
- Printed Circuit Boards
- Semiconductors
- Markets
- Electrical & Electronics
- Warning
Adequate ventilation of workplace and ovens is essential. These materials may cause injury to the skin following prolonged or repeated contact and dermatitis in susceptible individuals. In case of skin contact, wash thoroughly with soap and water. For eyes, flush immediately with plenty of water for at least 10 minutes and seek medical attention.
- Shelf LIfe
- 1 Year
- Technology
- Ready-to-Use Products
- Packaging Type
- Cartridges
- Industrial Usage
Practices of good housekeeping, safety and cleanliness should be followed before, during and after use.
- Packaging Options
Packaged in Pint, Quart, Gallon, and 5-Gallon size. Also available in 50ml, 200ml 400ml dual cartridges. Premixed and frozen - Packaged in 3cc, 5cc, 10cc and 30cc disposable syringes and ship in dry ice at -80°C
- Material Features
- High Performance
- Applications
This tough adhesive has an excellent combination of shear and peel strength.; It has also excellent impact and vibration resistance and low temperature flexibility.; This high-performance epoxy adhesive passes 500 thermal cycles from -50°C to 200°C.; Semiconductor: capillary flow underfill for flip chip mounted die and glob top fill encapsulant.; Electronics: heat sinking; thermally conductive potting and general protection of PCB and SMDs; potting and protection of resistor coils or Peltier devices.
- Compatible Polymers and Resins
- Acrylics
- Ready to Use Product Features
- Electrically Insulating
- Excellent Shear Strength
- Good Peeling Strength
- High Impact Resistance
- Low Temperature Flexibility
- Thermally Conductive
- Vibration Resistance
Technical data
Table 1 of 2
6 rows| Characteristic | Value | Unit |
|---|---|---|
| Viscosity (at 25°C) | min. 250000 | cPs |
| Mix Ratio by Weight (A:B) | 1:1 | — |
| Pot Life (at 25°C, 100g) | 45 | minutes |
| Recommended Cure (at 80°C) | 2 | hours |
| Alternate Cure (at 25°C) | 24 | hours |
| Alternate Cure (at 100°C) | 1 | hours |
Table 2 of 2
13 rows| Characteristic | Value | Unit |
|---|---|---|
| Specific Gravity | 2.1 | — |
| Hardness | 81 | Shore D |
| Lap Shear Strength to Aluminum | min. 3000 | psi |
| T-peel Strength to Aluminum | 14 | pli |
| Thermal Conductivity | 1.8 | W/m °K |
| Service Temperature Range | -55 to 200 | °C |
| Glass Transition Temperature (Tg) | 90 | °C |
| Coefficient of Linear Thermal Expansion (Below Tg) | 77 | 10^-6/°C |
| Coefficient of Linear Thermal Expansion (Above Tg) | min. 140 | 10^-6/°C |
| Dielectric Strength | 420 | Volts/mil |
| Dielectric Constant (at 1 kHz) | 5.3 | — |
| Dissipation Factor (at 1 kHz) | 0.4 | — |
