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EPOXIBOND™ EB-153

FLASHBOND™ UV-5402 is a low viscosity, flexible, light curing epoxy adhesive that offers excellent strenth and flexibility for reduced cracking. UV-5402 is low viscosity and high elongation. This product requires direct light exposure during cure. Because of the variability of different UV/LED light sources, it is suggested that the user test and specify intensity and exposure time. This product will cure in the presence of visible light (400-415nm) and can also cure down to 365nm.

Product families

Ready-to-Use Products — Adhesives & Sealants
  • Encapsulants
  • Structural Adhesives

Other characteristics

Brand
EPOXIBOND
Cure Method
Heat Cure
Product Type

2K (2 component) Adhesive, Adhesive, Encapsulant, Potting Compound; 2K (2 component) Adhesive; Adhesive; Encapsulant; Potting Compound

Application Area

Electronic Components, Medical Applications, Medical Devices, Optoelectronics Devices, Semiconductors; Electronic Components; Medical Applications; Medical Devices; Optoelectronics Devices; Semiconductors

Compatible Substrates & Surfaces
Ceramic, Glass, Metal
Markets
  • Consumer Goods
  • Electrical & Electronics
  • Healthcare & Pharma
Cure
Heat Cure
Availability
2 parts Kit
Packaged in Pint, Quart, and 1-Gallon size
Premixed and frozen
Packaged in 3cc, 5cc, 10cc and 30cc disposable syringes and ship in dry ice at -80°C.
Technology
Ready-to-Use Products
Frozen Adhesive

Thaw premixed frozen adhesive at room temperature for 5-10 minutes. Dispense adhesive and cure at recommended schedules.

Safety Information
For Industrial Use Only
Practices of good housekeeping, safety and cleanliness should be followed before, during and after use.
Warning
Adequate ventilation of workplace and ovens is essential. These materials may cause injury to the skin following prolonged or repeated contact and dermatitis in susceptible individuals. In case of skin contact, wash thoroughly with soap and water. For eyes, flush immediately with plenty of water for at least 10 minutes and seek medical attention. Refer to Safety Data Sheet (SDS) for additional health and safety information.
Use Instructions

Weigh each 10 grams of RESIN (PART-A) to 1 gram of Hardener (PART-B).; Mix until uniform. Scrape the sides and bottom of container repeatedly during mixing.; Apply to clean bonding surfaces and cure as recommended to achieve the desired properties.; Typical cured properties were determined using recommended cure schedule.

Technical data

Table 1 of 2

15 rows
CharacteristicValueUnit
Specific Gravity1.18—
Hardness87Shore D
Refractive Index1.56—
Spectral Transmission (at 800-1000 nm)min. 98%
Spectral Transmission (at 1100-1600 nm)min. 95%
Lap Shear Strength to Aluminium2600psi
Die Shear Strength (at 25°C)min. 5000psi
Service Temperature Range-55 to 250°C
Glass Transition Temperature (Tg)min. 115°C
Coefficient of Linear Thermal Expansion (Below Tg)5410⁻⁶/°C
Coefficient of Linear Thermal Expansion (Above Tg)19010⁻⁶/°C
Dielectric Strength380Volts/mil

Table 2 of 2

3 rows
CharacteristicValueUnit
Mix Ratio by Weight (Adhesive/Hardener)100/10—
Mixed Viscosity (at 25°C)3000 - 5000cps
Pot Life (at 25°C, 100 grams)5 - 6hours

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